Light emitting device package having a transparent cover
View Patent ↗A light emitting device package including a transparent cover having an electrode pattern formed on a bottom surface thereof; a light emitting device installed below the transparent cover and electrically connected to an external circuit via the electrode pattern; a fixing resin which fixes the light emitting device onto the bottom surface of the transparent cover; and a metal slug provided under the fixing resin to dissipate heat away from the light emitting device.
1. A light emitting device package, comprising:
a transparent cover;
an electrode pattern formed on a periphery of a wavelength conversion layer, wherein the wavelength conversion layer is formed in a center of a bottom surface of the transparent cover;
a light emitting device disposed below the transparent cover and electrically connected to the electrode pattern;
a fixing resin fixing the light emitting device to the transparent cover;
a metal slug, disposed below the fixing resin, which dissipates heat away from the light emitting device; and
a solder ball electrically connected to the electrode pattern;
wherein under bump metallization (UBM) layers form a soldering contact on an inner end portion of the electrode pattern contacted with the light emitting device and on an outer end portion of the electrode pattern contacted with the solder ball, and the soldering contact formed on the outer end portion of the electrode pattern having a wide area to attach to the solder ball.
2. The package of claim 1 , wherein the transparent cover comprises a plano-convex lens unit disposed above the light emitting device.
3. The package of claim 1 , wherein
the electrode pattern comprises a plurality of electrode patterns electrically separated from each other and formed on the bottom surface of the transparent cover; and
the solder ball is provided at an end of each of the plurality of electrode patterns.
4. The package of claim 1 , wherein the fixing resin comprises a light-transmissive material.
5. The package of claim 4 , wherein the fixing resin is colored.
6. The package of claim 1 , wherein the transparent cover comprises a luminescent material.
7. The package of claim 1 , wherein the transparent cover comprises a recess on the bottom surface thereof, and wherein the light emitting device is disposed in the recess.
8. The package of claim 1 , further comprising a seed layer between the fixing resin and the metal slug;
wherein the metal slug is formed on the seed layer by electroplating.
9. A light emitting device package, comprising:
a transparent cover;
a plurality of electrode patterns disposed on a bottom surface of the transparent cover;
a light emitting device disposed below the transparent cover and electrically connected to the plurality of electrode patterns;
a wavelength conversion layer, comprising a luminescent material, disposed between the transparent cover and the light emitting device and formed on a periphery of the electrode patterns;
a transparent epoxy resin which fixes the light emitting device onto the bottom surface of the transparent cover;
a metal slug disposed below the transparent epoxy resin; and
a solder ball formed on an end portion of each of the plurality of electrode patterns;
wherein UBM layers are formed on inner end portions of the electrode patterns contacted with the light emitting device and on outer end portions of the electrode patterns contacted with the solder ball.
10. The package of claim 9 , wherein the transparent cover comprises a plano-convex lens unit disposed above the light emitting device.
11. The package of claim 9 , wherein the transparent epoxy resin is colored.
12. The package of claim 9 , wherein the transparent cover comprises a recess in the bottom surface thereof and wherein the light emitting device is disposed in the recess.
13. A package for a light emitting device, the package comprising:
a transparent cover;
a plurality of light emitting devices disposed below the transparent cover;
electrode patterns formed on a bottom surface of the transparent cover and electrically connecting terminals of the plurality of light emitting devices and external circuits to each other;
a transparent epoxy resin which fixes the plurality of the light emitting devices to the bottom surface of the transparent cover, respectively;
a metal slug disposed below the transparent epoxy resin; and
a wavelength conversion layer formed on a periphery of the electrode patterns;
wherein a recess is formed on a bottom surface of the transparent cover, and the wavelength conversion layer and the light emitting device are partially inserted into the recess.
14. The package of claim 13 , wherein the transparent cover comprises a plano-convex lens unit disposed above the plurality of the light emitting devices.
15. The package of claim 13 , wherein the wavelength conversion layer comprises a luminescent material disposed between the transparent cover and the plurality of the light emitting devices.
16. The package of claim 13 , wherein the transparent cover comprises a plurality of recesses in the bottom surface thereof; and wherein each of the plurality of light emitting devices is disposed in one of the plurality of recesses.
17. The package of claim 13 , further comprising a solder ball disposed on a soldering contact having a wide area and formed on an end portion of each of the second plurality of electrode patterns.
18. A light emitting device package, comprising:
a transparent cover;
a plurality of light emitting devices disposed below the transparent cover;
a first plurality of electrode patterns, formed on a bottom surface of the transparent cover, which electrically connect terminals of the plurality of light emitting devices to each other;
a second plurality of electrode patterns, formed on the bottom surface of the transparent cover, which are electrically connected to terminals of the plurality of light emitting devices;
a transparent epoxy resin which fixes the plurality of the light emitting devices to the bottom surface of the transparent cover;
a metal slug disposed below the transparent epoxy resin; and
a wavelength conversion layer, comprising a luminescent material, disposed between the transparent cover and the light emitting device, and formed on a periphery of at least one of the first and second plurality of electrode patterns and which reduces a loss of a light to a minimum by temporarily converting or storing the light;
wherein a recess is formed on a bottom surface of the transparent cover, and the wavelength conversion layer and the light emitting device are partially inserted into the recess.