Embossing assembly and methods of preparation

1. A method for preparing an embossing assembly, which method comprises:

a) coating or laminating a photosensitive material over the outer surface of a sleeve;

b) selectively exposing the photosensitive material;

c) removing the photosensitive material either in areas that are exposed or in areas that are not exposed;

d) depositing a metal or alloy onto the outer surface of the sleeve where there is no photosensitive material present;

e) removing the photosensitive material remaining between the metal or alloy to form an embossing sleeve; and

f) mounting said embossing sleeve over a drum with an expandable insert between said embossing sleeve and said drum.

2. The method of claim 1 wherein said photosensitive material in step (a) is of a positive tone, negative tone or dual tone.

3. The method of claim 1 wherein said photosensitive material is a chemically amplified photoresist.

4. The method of claim 1 wherein said exposing of step (b) is carried out stepwise or continuous.

5. The method of claim 1 wherein said exposing of step (b) is carried out by IR, UV, e-beam or laser.

6. The method of claim 1 wherein said metal or alloy is nickel, cobalt, chrome, copper, zinc, iron, tin, silver, gold or an alloy derived therefrom.

7. The method of claim 1 wherein step (e) is carried out by a stripper.

8. The method of claim 1 wherein step (b) is carried out by coating a mask material over the photosensitive material, patterning the mask material to form a patterned mask material and exposing the photosensitive material through the patterned mask material.

9. The method of claim 8 wherein said patterning is carried out by photolithography or ablation.

10. The method of claim 1 further comprising

inserting a non-conductive thickness uniformer between the sleeve and at least one anode wherein said uniformer has at least one opening;

moving the uniformer in a longitudinal direction of the sleeve back and forth and simultaneously rotating the sleeve; and

directly exposing said metal or alloy on the outer surface of the sleeve to the anode through the opening of the uniformer.

11. The method of claim 1 further comprising:

providing at least an anode which is covered with a non-conductive material except the side lacing the sleeve or two opposite sides one of which is facing the sleeve; and

moving the anode covered with the non-conductive material in a longitudinal direction of the sleeve back and forth and simultaneously rotating the sleeve.

12. The method of claim 10 further comprising monitoring and adjusting in situ the moving speed of the uniformer to homogenize the deposit thickness of the metal or alloy.

13. The method of claim 12 wherein the moving speed of the uniformer is adjusted based on the value ampere×hour, which is proportional to the deposit thickness.

14. The method of claim 11 further comprising monitoring and adjusting in situ the moving speed of the anode covered with the non-conductive material to homogenize the deposit thickness of the metal or alloy.

15. The method of claim 14 wherein the moving speed of the uniformer is adjusted based on the value of ampere×hour, which is proportional to the deposit thickness.

16. The method of claim 8 further comprising coating a barrier layer between the mask material and the photosensitive material.

17. The method of claim 1 wherein said expandable insert has multiple tightening means.

18. The method of claim 1 wherein said expandable insert is formed of a metal, an alloy, a metal oxide of said metal, or stainless steel.

19. The method of claim 18 wherein said metal is aluminum, copper, zinc, nickel, iron, titanium or cobalt.

20. The method of claim 1 wherein said expandable insert is protected with an inert material.

21. The method of claim 1 wherein said expandable insert is formed of a plastic material.