Lead-free solder
According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
1 . A lead-free solder comprising:
an alloy rolled into a shape of sheet, the alloy comprising:
tin;
from 10 wt % to less than 25 wt % of silver; and
from 3 wt % to 5 wt % of copper;
wherein the alloy is free from lead.
2 . The lead-free solder according to claim 1 , wherein the alloy comprises 10 wt % to 20 wt % of silver.
3 . The lead-free solder according to claim 1 , wherein the alloy has a shape of sheet with a thickness from 40 μm to 120 μm.
4 . The lead-free solder according to claim 1 , wherein the alloy has a shape of a disk with the same diameter as a joined member.