Method for fabricating a system for displaying images
The invention provides a method for manufacturing systems for displaying images. A representative system incorporates electroluminescent devices, comprising the following steps. A substrate having an active region and a pad region is provided. A thin film transistor is formed on the active region and a pad electrode is formed on the pad region, wherein the thin film transistor comprise a source electrode, a gate electrode, a drain electrode, and a gate insulator. A protective layer is formed on the active region and pad region. A planarization layer is formed on the active region and pad region, after forming color filter patterns on the protective layer on the active region. A first contact hole is formed to pass through the planarization layer of the active region, exposing the surface of the protective layer directly on the drain electrode. A drain via hole is formed to pass through the protective layer of the active region after the formation of the color filter patterns and the planarization layer, exposing the drain electrode. A pad via hole is formed to pass through the protective layer of the pad region after the formation of planarization layer, exposing the pad electrode.
1 . A method of fabricating a system for displaying images, wherein the system comprising electroluminescent devices, the method comprising:
providing a substrate having an active region and a pad region;
forming a thin film transistor on the active region and a pad electrode on the pad region, wherein the thin film transistor comprise a source electrode, a gate electrode, a drain electrode, and a gate insulator;
forming a protective layer on the active region and pad region;
forming color filter patterns on the protective layer on the active region, wherein the color filter patterns are separated by first contact holes over the drain electrode;
forming a planarization layer on the active region and pad region;
forming a second contact hole passing through the planarization layer of the active region, exposing the surface of the protective layer directly on the drain electrode;
forming a third contact hole passing through the planarization layer of the pad region, exposing the surface of the protective layer directly on the pad electrode;
forming a drain via hole passing through the protective layer of the active region after the formation of color filter patterns and planarization layer, exposing the drain electrode; and
forming a pad via hole passing through the protective layer of the pad region after the formation of planarization layer, exposing the pad electrode.
2 . The method as claimed in claim 1 , further comprising
forming an organic light-emitting diode on the active region, wherein an anode of the organic light-emitting diode electrically connects the drain electrode through the second contact hole and the drain via hole.
3 . The method as claimed in claim 1 , wherein the size of the second contact hole is larger than the size of the drain via hole, and the second contact hole exposes the top surface of the protective layer after forming the drain via hole.
4 . The method as claimed in claim 1 , wherein the size of the third contact hole is larger than the size of the pad via hole, and the third contact hole exposes the top surface of the protective layer after forming the pad via hole.
5 . The method as claimed in claim 1 , wherein the first contact hole directly lies on the drain via hole.
6 . The method as claimed in claim 1 , wherein the third contact hole directly lies on the pad via hole.
7 . The method as claimed in claim 1 , wherein the second contact hole and the third contact hole are formed by the same process.
8 . The method as claimed in claim 1 , wherein the drain via hole and the pad via hole are formed by the same process.
9 . A method of fabricating a system for displaying images, wherein the system comprising electroluminescent devices, the method comprising:
providing a substrate having a thin film transistor, wherein the thin film transistor comprises a source electrode, a gate electrode, a drain electrode, and a gate insulator;
sequentially forming a protective layer, color filter patterns, and a planarization layer on the substrate, wherein the color filter patterns are separated by first contact holes over the drain electrode;
forming a second contact hole passing through the planarization layer, exposing the surface of the protective layer directly on the drain electrode; and
forming a drain via hole passing through the protective layer after the formation of color filter patterns and planarization layer, exposing the drain electrode.
10 . The method as claimed in claim 9 , further comprising
forming an organic light-emitting diode, wherein an anode of the organic light-emitting diode electrically connects the drain electrode through the contact hole and the drain via hole.
11 . The method as claimed in claim 9 , wherein the size of the second contact hole is larger than the size of the drain via hole, and the secondt contact hole exposes the top surface of the protective layer after forming the drain via hole.
12 . The method as claimed in claim 9 , wherein the first contact hole directly lies on the drain via hole.
13 . The method as claimed in claim 9 , wherein the protective layer comprises silicon nitride, silicon oxide, BPSG, PSG or organic resin film.
14 . A method of fabricating a system for displaying images, wherein the system comprising electroluminescent devices, the method comprising:
providing a substrate having a pad electrode;
sequentially forming a protective layer and a planarization layer covering the pad electrode;
forming a contact hole passing through the planarization layer, exposing the surface of the protective layer directly on the pad electrode; and
forming a pad via hole passing through the protective layer after the formation of planarization layer, exposing the pad electrode.
15 . The method as claimed in claim 14 , wherein the size of the contact hole is larger than the size of the pad via hole, and the contact hole exposes the top surface of the protective layer after forming the pad via hole.
16 . The method as claimed in claim 14 , wherein the contact hole directly lies on the pad via hole.
17 . The method as claimed in claim 14 , wherein the protective layer comprises silicon nitride, silicon oxide, BPSG, PSG or organic resin film.