Method of improving cathode connection integrity in solid electrolytic capacitors using secondary adhesive
View Patent ↗A solid electrolytic capacitor body is attached to lead frame by a secondary adhesive and a method for forming the capacitor assembly. The assembly consists of a chip that has conductive adhesive formed on the cathode surface. Secondary adhesive is placed adjacent to the conductive adhesive. Lead frame is attached to these adhesives and the adhesives are cured simultaneously. Secondary adhesive can be thermally or UV cured. The solid electrolytic capacitor formed by this method showed improved adhesion between lead frame and capacitor body.
1. A capacitor comprising:
an anode;
an anode lead wire;
an anode terminal;
an insulating layer on said anode;
at least one cathode layer on said insulating layer;
a cathode lead adhered to said cathodic layer; and a cathode terminal;
wherein a conductive adhesive and a nonconductive secondary adhesive are used to adhere said cathode lead to said cathodic layer.
2. A capacitor according to claim 1 wherein the conductive adhesive and secondary adhesive comprise the same adhesive resin.
3. A capacitor according to claim 1 where the conductive adhesive and secondary adhesive comprise different adhesive resins.
4. A capacitor according to claim 1 wherein at least one of said conductive adhesive and said secondary adhesive is thermosetting adhesive.
5. A capacitor according to claim 1 wherein said conductive adhesive contains particles of metals selected from the group consisting of Ag, Au, Ni and Cu.
6. A capacitor according to claim 5 wherein said particles are Ag particles.
7. A capacitor according to claim 1 wherein said secondary adhesive contains particles selected from the group consisting of molecular silica and nanoclay.
8. A capacitor according to claim 1 wherein the secondary adhesive is placed on the negative side of the cathode lead.
9. A method for bonding a capacitor to a lead frame comprising dispensing a non-conductive secondary adhesive adjacent to a conductive adhesive on a cathode lead frame.
10. A method according to claim 9 wherein said secondary adhesive is applied on the negative side of a cathode lead frame.
11. A method according to claim 9 wherein the conductive adhesive and secondary adhesive are co-cured.