Semiconductor device

1. A semiconductor device comprising:

a semiconductor chip;

a plurality of electrodes formed on the semiconductor chip and arranged along one side of the semiconductor chip, the plurality of electrodes including a first electrode and a second electrode;

a resin protrusion formed on the semiconductor chip and extending in a direction which intersects the side; and

a plurality of electrical connection sections formed on the resin protrusion, the plurality of electrical connection sections including a first electrical connection section and a second electrical connection section, each electrical connection section being electrically connected to a respective one of the plurality of electrodes,

the first electrical connection section being provided as a portion of a first interconnect that extends from the first electrode over the resin protrusion,

the second electrical connection section being provided as a portion of a second interconnect that extends from the second electrode over the resin protrusion,

a first distance between the first electrical connection section and the first electrode is different than a second distance between the second electrical connection section and the second electrode,

a surface of the semiconductor chip on which the electrodes are formed is rectangular,

the side being a long side of the rectangular surface, and

the plurality of electrical connection sections being arranged along a line which intersects the side in plan view,

wherein the resin protrusion extends obliquely with respect to the side in plan view.

2. The semiconductor device as defined in claim 1 , comprising:

two or more of the resin protrusions adjacently arranged in a direction along the side.

3. The semiconductor device as defined in claim 1 , further comprising:

another resin protrusion extending along the side.