Granted Patent B1

US 7,339,268 · App. 11/500,567 · Granted Mar 4, 2008

Abstract

Claims (17)

1. A flex cable comprising:

a heat sink layer;

a semiconductor die including bonding pads;

a flex cable substrate comprising a flexible dielectric material, the flex cable substrate disposed between the heat sink layer and the semiconductor die and having an aperture disposed therethrough and aligned with the semiconductor die;

conductive traces disposed upon the flex cable substrate;

a first set of solder balls connecting the bonding pads to the conductive traces; and

a thermal conductor disposed within the aperture and contacting both the semiconductor die and the heat sink layer.

2. The flex cable of claim 1 wherein the heat sink layer comprises aluminum.

3. The flex cable of claim 1 wherein the heat sink layer comprises stainless steel.

4. The flex cable of claim 1 wherein the heat sink layer comprises a stiffener.

5. The flex cable of claim 1 wherein the semiconductor die comprises a preamplifier.

6. The flex cable of claim 1 wherein the semiconductor die comprises a flip chip.

7. The flex cable of claim 1 wherein the thermal conductor includes a second set of solder balls.

8. The flex cable of claim 7 wherein the thermal conductor further includes a thermally conductive layer disposed between the second set of solder balls and the heat sink layer.

9. The flex cable of claim 7 wherein the second set of solder balls are not electrically connected to the bonding pads.

10. The flex cable of claim 7 wherein a contact angle between the heat sink layer and the solder balls of the second set is less than 90°.

11. The flex cable of claim 1 wherein the stiffener further includes a pedestal disposed within the aperture.

Assignments (8)