Intelligent cooling method combining passive and active cooling components
A method for cooling a semiconductor including passive cooling including transferring heat via passive cooling components; active cooling including transferring heat via active cooling components; and controlling the active cooling based on temperature of the semiconductor. A cooling system for a semiconductor including: a passive component in thermal contact with the semiconductor; an active cooling component in thermal contact with the semiconductor; and a controller controlling the active cooling component.
1. A cooling system for a semiconductor comprising:
a passive cooling component in thermal contact with the semiconductor;
wherein the passive cooling component comprises a plurality of heat sink fins on top of a heat sink base cavity;
an active cooling component in thermal contact with the semiconductor;
wherein the active cooling component further comprises a plurality of magneto-hydro-dynamic (MHD) pipes, carrying an MHD fluid;
a controller controlling the active cooling component; and
the MHD pipes being substantially normal to and passing through the heat sink fins.
2. The system of claim 1 further comprises an MHD pump connected to the MHD pipes.
3. The system of claim 1 further comprises a reservoir for the MHD fluid.
4. The system of claim 3 further comprises an auxiliary heat sink in thermal contact with the reservoir.
5. The system of claim 1 , the controller further comprises:
a plurality of temperature sensors extending from a bottom of a heat sink base cavity to a controller input port;
a plurality of wires extending from an output port of the controller to a magneto-hydro-dynamic (MHD) pump.
6. The system of claim 5 , wherein one end of at least one of the plurality of temperature sensors is placed near a hot spot of the semiconductor.
7. A cooling system for a semiconductor comprising:
a passive cooling component in thermal contact with the semiconductor;
wherein the passive cooling component comprises a plurality of heat sink fins on top of a heat sink base cavity;
an active cooling component in thermal contact with the semiconductor;
wherein the active cooling component further comprises a plurality of magneto-hydro-dynamic (MHD) pipes, carrying an MHD fluid;
a controller controlling the active cooling component; and
the MHD pipes extending from a topmost plate of the heat sink fins to a bottom of the heat sink base cavity.
8. The system of claim 7 further comprises the MHD pipes being positioned over a hot spot of the semiconductor.