Single-crystal nitride-based semiconductor substrate and method of manufacturing high-quality nitride-based light emitting device by using the same
View Patent ↗A nitride-based light emitting device is manufactured by using a single-crystal nitride-based semiconductor substrate. A seed material layer is deposited on a first substrate where organic residues including a natural oxide layer are removed from an upper surface of the first substrate. A multifunctional substrate is grown from the seed material layer. The single-crystal nitride-based semiconductor layer including a nitride-based buffer layer is formed on the multifunctional substrate. The seed material layer primarily assists the growth of the multifunctional substrate, which is essentially required for the growth of the single-crystal nitride-based semiconductor substrate. The multifunctional substrate is prepared in the form of a single-crystal layer or a poly-crystal layer having a hexagonal crystalline structure. The light emitting device employing the single-crystal nitride-based semiconductor substrate is used as a next-generation white light source having high capacity, large area, high brightness and high performance.
1. A method of growing a single-crystal nitride-based semiconductor substrate, the method comprising:
depositing a seed material layer on an upper surface of a first substrate and growing a multifunctional substrate from an upper surface of the seed material layer;
forming a multi-layer on an upper surface of the multifunctional substrate by (metal-organic chemical vapor deposition) MOCVD, in which the multi-layer consists of a nitride-based buffer layer and a single-crystal nitride-based layer stacked on the nitride-based buffer layer;
removing the seed material layer, and the first substrate by performing wet etching or dry etching; and
performing a heat-treatment process in order to enhance crystallinity of the multifunctional substrate and the single-crystal nitride-based layer obtained through the above steps.
2. The method of claim 1 , wherein the first substrate includes sapphire, silicon (Si), zinc oxide (ZnO) or gallium arsenide (GaAs).
3. The method of claim 1 , further comprising forming a ZnO-based layer between the first substrate and the seed material layer, wherein the ZnO-based layer is removed with the seed material layer and the first substrate.
4. The method of claim 1 , wherein the heat-treatment is performed at a temperature of 1500° C. or less under oxygen (O 2 ), nitrogen (N 2 ), hydrogen (H 2 ), argon (Ar), or air atmosphere.
5. The method of claim 1 , wherein a sequence of a manufacturing procedure for the nitride-based light emitting device is changeable.
6. A method of manufacturing a nitride-based light emitting device, the method comprising:
depositing a seed material layer on an upper surface of a first substrate and growing a multifunctional substrate from an upper surface of the seed material layer;
forming a multi-layer on an upper surface of the multifunctional substrate by (metal-organic chemical vapor deposition) MOCVD, in which the multi-layer consists of a nitride-based buffer layer, and a single-crystal nitride-based layer including an n-nitride-based cladding layer a nitride-based active layer, and a p-nitride-based cladding layer, which are sequentially stacked on the upper surface of the multifunctional substrate;
removing the seed material layer, and the first substrate by performing wet etching or dry etching;
performing a heat-treatment process in order to enhance crystallinity of the multifunctional substrate and the multi-layer obtained through the above steps; and
selectively depositing reflective electrode materials or transparent electrode materials on the multi-layer having the multifunctional substrate and then performing an ohmic heat-treatment process.
7. The method of claim 6 , wherein the first substrate includes sapphire, silicon (Si), zinc oxide (ZnO) or gallium arsenide (GaAs).
8. The method of claim 6 , further comprising forming a ZnO-based layer between the first substrate and the seed material layer, wherein the ZnO-based layer is removed with the seed material layer and the first substrate.
9. The method of claim 6 , wherein the heat-treatment is performed at a temperature of 1500° C. or less under oxygen (O 2 ), nitrogen (N 2 ), hydrogen (H 2 ), argon (Ar), or air atmosphere.
10. The method of claim 6 , wherein a sequence of a manufacturing procedure for the nitride-based light emitting device is changeable.