Platinum electrode surface coating and method for manufacturing the same
An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; a surface coating of platinum having a rough configuration and an increase in the surface area of 5 times to 500 times of the corresponding surface area resulting from the basic geometric shape of the electrode. A method for electroplating an electrode surface with platinum coating having a rough surface, comprising electroplating the surface of a conductive substrate at a rate such that the metal particles form on the conductive substrate faster than necessary to form shiny platinum and slower than necessary to form platinum black.
1. A method of forming a non-porous platinum coating on a platinum substrate having a basic geometric shape, the platinum coating having a rough surface and grains, comprising the steps of:
selecting an electroplating solution having a basic pH and containing Na 2 HPO 4 , NaH 2 PO 4 , and PtCl 4 ;
selecting a power source and connecting an anode, a reference electrode, and a cathode to said power source;
placing said anode, said cathode, said reference electrode for use as a reference in controlling said power source, and said electroplating solution in an electroplating cell;
agitating said electroplating solution;
electroplating for about 10 minutes at a rate of 0.25 to 0.35 micrometers per minute to form a non-porous biocompatible platinum coating on said cathode by supplying power to said cathode, said power having an electrode constant voltage, and stopping plating after achieving a thickness of 2.5 micrometers to 3.5 micrometers;
wherein said step of electroplating said non-porous biocompatible platinum coating is electroplating a surface of a rough configuration, having regular bead shaped particles with particle sizes ranging between 0.1 micrometer and 2.0 micrometers in size on said cathode, and an increase in surface area of 70 to 73 times of a surface area defined by the basic geometric shape, within the thickness of 2.5 micrometers to 3.5 micrometers.
2. The method of claim 1 wherein said step of electroplating is controlled by said electrode constant voltage.
3. The method of claim 1 wherein said step of electroplating is partially diffusion limited and is controlled by said electrode constant voltage.
4. The method of claim 1 wherein said step of electroplating is performed in said basic electroplating solution at a pH of 7.9 and not in an acidic electroplating solution.
5. The method of claim 1 wherein said step of electroplating is performed lead-free.