Systems for displaying images
View Patent ↗Systems for displaying images are provided. An embodiment of a system comprises a liquid crystal display module, and the liquid crystal display module comprises a backlight assembly. The backlight module primarily includes a circuit board and at least an LED disposed on a first planar side of the circuit board. The circuit board comprises at least a hole and a heat conductor extending through the hole. Heat from the LED on the first planar side is dissipated to a second planar side of the circuit board by the heat conductor through the hole.
1. A system for displaying images, comprising:
a liquid crystal display module, comprising:
a backlight assembly optically coupled to the liquid crystal display module, comprising:
a circuit board, comprising at least a hole through the circuit board between a first planar side and a second planar side, and a heat conductor extending through and filling the hole from the second side to the first side,
a thermal conductive member in contact with the heat conductor on the second side of the circuit board, wherein the thermal conductive member includes two electrically insulating layers and a thermal conductive layer disposed therebetween, and
an LED, disposed on the first side of the circuit board, wherein heat from the LED on the first side is dissipated to the second side by the heat conductor through the hole.
2. The system as claimed in claim 1 , wherein the backlight assembly further comprises a plurality of LEDs, wherein the circuit board comprises a plurality of holes between the LEDs through which the heat conductor extends.
3. The system as claimed in claim 2 , wherein the conductor also conducts electricity, and wherein the conductor electrically connects two of the LEDs.
4. The system as claimed in claim 1 , wherein the conductor is part of an electronic circuit of the circuit board.
5. The system as claimed in claim 1 , wherein the thermal conductive member comprises at least one of ceramic material, adhesive material, and epoxy material.
6. The system as claimed in claim 1 , wherein the backlight assembly further comprises a frame in contact with the thermal conductive member, whereby heat is dissipated from the thermal conductive member to the frame.
7. The system as claimed in claim 6 , wherein the frame comprises copper.
8. The system as claimed in claim 6 , wherein the frame comprises aluminum.
9. The system as claimed in claim 1 , wherein the electrically insulating layers comprises silicon.
10. The system as claimed in claim 1 , wherein the thermal conductive layer comprises metal.
11. The system as claimed in claim 1 , wherein the thermal conductive layer comprises ceramic material.
12. The system as claimed in claim 1 , wherein diameter of the hole is at least 0.3 mm.
13. The system as claimed in claim 1 , wherein the circuit board comprises a plurality of holes, and space between two of the holes is at least 0.3 mm.
14. The system as claimed in claim 1 , further comprising:
a liquid crystal display device comprising the liquid crystal display module; and
a controller coupled to the liquid crystal display device, being operative to control the liquid crystal display module to render images in accordance with an image data.
15. The system as claimed in claim 14 , wherein the system comprises an electronic device comprising the liquid crystal display device.
16. The system as claimed in claim 15 , wherein the electronic device is a laptop computer, a mobile phone, a digital camera, a personal digital assistant (PDA), a desktop computer, a television, a car display or a portable DVD player.
17. A liquid crystal display module, comprising:
a backlight assembly optically coupled to the liquid crystal display module, comprising:
a linear array of LEDs,
a circuit board supporting the linear array of LEDs, wherein an array of holes is provided in the circuit board between two LEDs and between a first planar side and a second planar side, and the array of holes are filled with a heat conductive material, with no connection to any circuit device on the first planar side, whereby heat from the array of LEDs is dissipated from the first planar side to the second planar side through the heat conductive material in the array of holes, and
a thermal conductive member in contact with the heat conductive material on the second side of the circuit board, wherein the thermal conductive member includes two electrically insulating layers and a thermal conductive layer disposed therebetween.
18. The system as claimed in claim 1 , wherein the LCD is disposed entirely and having its base on the first planar side of the circuit board.