Process for molding a friction wafer
View Patent ↗A process and apparatus for making die-dried friction wafers collects friction particulates in a mold defining a wafer. The mold includes at least one perforate wall portion against which an aqueous slurry including the particulates is passed to form at least one layer on the wall as the particulates collect in the mold. The collection is dried followed by curing, and may be cured in the mold by heating.
1. A method for molding a fiber friction wafer comprising:
passing aqueous slurry comprising paper particulate, friction fillers, and resin in a direction through a mold chamber including at least one perforated mold wall to form a net shape, molded part on said at least one perforated mold wall;
reducing water content of said net shape, molded part; and
curing said net shape, molded part.
2. The invention as described in claim 1 and further comprising processing said molded part during at least one of said reducing and curing steps.
3. The invention as described in claim 1 wherein said curing step includes bonding said molded part to a core.
4. The invention as described in claim 1 wherein said curing step comprises heating said mold chamber.
5. The invention as described in claim 1 wherein said passing includes pouring a predetermined amount of aqueous slurry into said mold cavity.
6. The invention as described in claim 1 wherein said passing comprises displacing said mold chamber within an aqueous slurry.
7. The invention as described in claim 1 wherein said passing comprises displacing said slurry relative to said perforated mold wall by applying fluid pressure to said wall.
8. The invention as described in claim 6 wherein said passing comprises pulling a vacuum to deposit slurry constituents onto said perforated mold wall.
9. The invention as described in claim 1 wherein said passing comprises evacuating wafer past said perforated mold wall, leaving slurry constituents attached to mold wall.
10. A method for molding at least one fibrous friction wafer, the method comprising:
collecting friction paper constituents in an aqueous slurry with friction particulate and beater-add resin in a mold chamber on at least one perforated, net shape mold wall to form a molded wafer on said at least one wall;
reducing water content of said molded wafer, and
heating said molded wafer to at least partially cure the resin in said molded wafer.
11. The invention as described in claim 10 wherein said collecting slurry comprises sequentially accumulating at least two layers.
12. The invention as described in claim 10 wherein said method further comprises introducing into a solution of liquid resin to at least one layer of molded wafer to increase resin content of the wafer.
13. The invention as described in claim 10 wherein said curing step comprises heating said mold chamber.
14. The invention as described in claim 10 wherein said heating comprises transferring said molded part to a separate heated mold.
15. The invention as described in claim 10 wherein said heating comprises transferring said molded wafer to at least one heated press platen.