Semiconductor light-emitting device with high brightness and low operating voltage
View Patent ↗A semiconductor light-emitting device has a semiconductor substrate, an n-type cladding layer, an active layer, a p-type cladding layer, a p-type buffer layer, a p-type contact layer, and a current spreading layer. A part or all of the p-type buffer layer has a low Mg concentration buffer layer with a Mg concentration of 3.0×10 17 /cm 3 or less and a film thickness of 50 nm or more.
1. A semiconductor light-emitting device, comprising:
a semiconductor substrate;
semiconductor layers formed on the semiconductor substrate, the semiconductor layers comprising an n-type cladding layer, an active layer, a p-type cladding layer, a p-type buffer layer, and a p-type contact layer; and
a current spreading layer formed on the p-type contact layer, the current spreading layer comprising a metal-oxide material,
wherein the active layer comprises (Al x1 Ga 1−x1 ) y1 In 1−y1 P (where 0≦X1≦1, 0.4≦Y1≦0.6,
the n-type cladding layer and the p-type cladding layer respectively comprise (Al x2 Ga 1−x2 ) y2 In 1−y2 P(where 0.6≦X2≦1, 0.4≦Y2≦0.6),
the p-type buffer layer comprises Al x3 Ga 1−x3 As (where 0.45≦X3≦1),
the p-type cladding layer and the p-type buffer layer comprise Mg as a main dopant,
the p-type contact layer comprises Zn as a main dopant, and
a part or all of the p-type buffer layer comprises Mg-doped buffer layer and an undoped layer, the undoped buffer layer being provided at a side of the p-type contact layer.
2. The semiconductor light-emitting device according to claim 1 , wherein:
the undoped buffer layer is located within a range of 1,500 nm from an interface between the p-type buffer layer and the p-type contact layer.
3. The semiconductor light-emitting device according to claim 1 , wherein:
the undoped buffer layer and the p-type buffer layer are transparent to an emission wavelength, and the p-type buffer layer comprises a thickness of 200 nm or more and 5000 nm or less.
4. The semiconductor light-emitting device according to claim 1 , wherein:
the p-type contact layer comprises a Zn concentration of 1.0x 19 /cm 3 or more.
5. The semiconductor light-emitting device according to claim 1 , wherein:
the p-type contact layer comprises Al x4 Ga l−x4 As (where 0≦X4≦0.4) and a thickness of 1 nm or more and 30 nm or less.
6. The semiconductor light-emitting device according to claim 1 , wherein:
the current spreading layer comprises ITO (indium tin oxide) and a carrier concentration of 8×10 20 /cm 3 or more.
7. The semiconductor light-emitting device according to claim 1 , further comprising:
a semiconductor reflective film comprising a pair of semiconductor layers different in refractive index between the semiconductor substrate and the n-type cladding layer.
8. The semiconductor light-emitting device according to claim 7 , wherein:
the semiconductor reflective film comprises (Al x5 Ga l−x5 ) y5 In l−y5 P )where 0≦X5≦1, 0.4≦Y5≦0.6) or Al x6 Ga l−x6 As (where 0≦X6≦1).
9. The semiconductor light-emitting device according to claim 1 , wherein:
the current spreading layer comprises a thickness in a range of ±30% of d obtained by a relational expression: d=A ×λp/(4 x n), where A is a constant of 1 or 3, λp is an emission wavelength (nm), and n is an refractive index.