Gas dispersion plate and manufacturing method therefor
To provide an inexpensive gas dispersion plate having a high corrosion resistance to halogen-based corrosive gasses and a plasma thereof, and capable of preventing particle generation from the gas hole, thereby contributing to an improvement in the production yield of the semiconductor devices. The gas dispersion plate includes one or plural gas holes in a base material formed by a Y 2 O 3 ceramic material having a relative density of 96% or more, in which an edge part of the gas hole is formed by a sand blasting process into a rounded shape with a radius of curvature of 0.2 mm or more.
1 . A gas dispersion plate comprising a base material comprising Y 2 O 3 ceramics of which relative density is 96% or more, one or plural gas holes in the base material,
wherein an edge part of the gas hole is formed by a sand blasting process into a rounded shape with a radius of curvature of 0.2 mm or more.
2 . A manufacturing method for a gas dispersion plate comprising the steps of:
adding water and a binder to an Y 2 O 3 raw material to obtain slurry;
forming the slurry into granules by a spray-dryer;
press molding the obtained granules to obtain a molded member;
calcining the molded member to evaporate the binder;
sintering the molded member to obtain a sintered Y 2 O 3 ceramic member with a relative density of 96% or more;
forming one or plural gas holes on the sintered member; and
performing a sand blasting process on an edge part of the gas hole so as to form a rounded shape.
3 . A gas dispersion plate comprising:
a base material comprising Y 2 O 3 ceramic of which purity is 99% or more;
one or plural gas holes formed in the base material,
wherein the base material is sintered at temperature of from 1780 to 1820° C. in a hydrogen atmosphere, and
the gas hole is formed while applying an ultrasonic vibration to a working jig.
4 . A manufacturing method for a gas dispersion plate comprising the steps of:
adding water and a binder to a Y 2 O 3 raw material of a purity of 99% or higher to obtain a slurry;
forming the slurry into granules by a spray-dryer;
press molding the obtained granules to obtain a molded member;
calcining the molded member to evaporate the binder;
sintering the molded member at a temperature of from 1780 to 1820° C. in a hydrogen atmosphere to obtain a sintered Y 2 O 3 ceramic member; and
forming one or plural gas holes in the sintered member under an application of an ultrasonic vibration to a working jig.