Nozzle arrangement for an inkjet printhead that incorporates a movement transfer mechanism
View Patent ↗A nozzle arrangement for an inkjet printhead includes a substrate that incorporates drive circuitry and defines an ink inlet channel. At least one wall extends from the substrate. A roof is fast with the at least one wall and defines an ink ejection port which is in fluid communication with an ink chamber defined by the roof, the at least one wall and the substrate, the ink chamber being in fluid communication with the ink inlet channel. An ink ejection member is interposed between the ink inlet channel and the ink ejection port such that reciprocal movement of the ink ejection member causes ejection of ink from the ink ejection port. An actuator is connected to the drive circuitry at a fixed end and is configured so that a free end is displaced reciprocally with respect to the substrate on receipt of an electrical signal by the actuator from the drive circuitry. A movement transfer mechanism is interposed between the free end of the actuator and the ink ejection member such that reciprocal movement of the free end is transferred to the ink ejection member.
1. A nozzle arrangement for an inkjet printhead, the nozzle arrangement comprising:
a substrate that incorporates drive circuitry and defines an ink inlet channel;
at least one wall extending from the substrate;
a roof fast with the at least one wall and defining an ink ejection port which is in fluid communication with an ink chamber defined by the roof, the at least one wall and the substrate, the ink chamber being in fluid communication with the ink inlet channel; and
an ink ejection member interposed between the ink inlet channel and the ink ejection port such that reciprocal movement of the ink ejection member causes ejection of ink from the ink ejection port;
an actuator which is connected to the drive circuitry at a fixed end and is configured so that a free end is displaced reciprocally with respect to the substrate on receipt of an electrical signal by the actuator from the drive circuitry; and
a movement transfer mechanism interposed between the free end of the actuator and the ink ejection member such that reciprocal movement of the free end is transferred to the ink ejection member.
2. A nozzle arrangement as claimed in claim 1 , wherein the substrate is comprised of:
a silicon wafer substrate;
an electrical drive circuitry layer positioned on the silicon wafer substrate; and
an ink passivation layer positioned on the electrical drive circuitry layer.
3. A nozzle arrangement as claimed in claim 2 , wherein the electrical drive circuitry layer comprises CMOS drive circuitry to provide current to the actuator upon receipt of an enabling signal from a microprocessor.
4. A nozzle arrangement as claimed in claim 1 , wherein the ink inlet channel is substantially aligned with the ink ejection port.
5. A nozzle arrangement as claimed in claim 1 , wherein the actuator is a thermal bend actuator which can bend upon heating with an electrical current to act on the movement transfer mechanism.
6. A nozzle arrangement as claimed in claim 5 , further comprising an anchor extending from the support and to which the fixed end of the thermal bend actuator is attached.
7. A nozzle arrangement as claimed in claim 6 , wherein the ink ejection member is in the form of a paddle located within the ink chamber, the paddle substantially spanning the ink chamber.
8. A nozzle arrangement as claimed in claim 1 , in which the movement transfer mechanism is a lever mechanism with an effort formation fast with the free end of the actuator and a load formation fast with the ink ejection member.