Polyimide film and use thereof
View Patent ↗A polyimide film in which the dimensional change is reduced when it has undergone a step of laminating a metal on the polyimide film or a step of etching the metal layer to form wiring, and the rate of dimensional change can be stabilized across the entire width is provided. The object can be solved by a polyimide film produced by a continuous process, wherein when a coefficient of linear expansion a in a direction of the molecular orientation axis and a coefficient of linear expansion b in a direction perpendicular to the molecular orientation axis are measured in the temperature range of 100° C. to 200° C., a and b satisfy a particular relationship across the entire width, or a polyimide film produced by a continuous process, wherein when a tear propagation resistance c in the direction of the molecular orientation axis and a tear propagation resistance d in the direction perpendicular to the molecular orientation axis are measured, c and d satisfy a particular relationship across the entire width.
1. A polyimide film produced by a continuous process, wherein when a coefficient of linear expansion a in a direction of the molecular orientation axis and a coefficient of linear expansion b in a direction perpendicular to the molecular orientation axis are measured in the temperature range of 100° C. to 200° C., a coefficient of linear expansion ratio A represented by equation (1):
A= 1+{( b−a )/( b+a )}×2 (1)
is in the range of 1.13 to 3.00 across the entire width.
2. The polyimide film according to claim 1 , wherein the difference between the maximum A MAX and the minimum A MIN of the coefficient of linear expansion ratio A is 0.30 or less.
3. The polyimide film according to claim 1 , wherein the difference between the maximum and the minimum of the molecular orientation angle of the polyimide film is 40° or less across the entire width.
4. The polyimide film according to claim 1 , wherein when the transferring direction (MD direction) during the continuous production is defined as 0°, the molecular orientation angle is within 0±20°.
5. The polyimide film according to claim 1 , wherein the average coefficient of linear expansion in the temperature range of 100° C. to 200° C. is in the range of 5.0 to 25.0 ppm/° C.
6. A laminate comprising the polyimide film according to claim 1 .
7. The laminate according to claim 6 , further comprising at least a metal layer.
8. A flexible printed circuit board comprising the polyimide film according to claim 1 as a base film.
9. A polyimide film produced by a continuous process, wherein when a tear propagation resistance c in a direction of the molecular orientation axis and a tear propagation resistance d in a direction perpendicular to the molecular orientation axis are measured, the tear propagation resistance ratio d/c is in the range of 1.01 to 1.20 and the difference between the maximum and the minimum of the tear propagation resistance ratio d/c is 0.10 or less across the entire width.
10. The polyimide film according to claim 9 , wherein the difference between the maximum and the minimum of the molecular orientation angle of the polyimide film is 40° or less across the entire width.
11. The polyimide film according to claim 9 , wherein when the transferring direction (MD direction) during the continuous production is defined as 0°, the molecular orientation angle of the polyimide film is within 0±20° across the entire width.
12. A laminate comprising the polyimide film according to claim 9 .
13. The laminate according to claim 12 , further comprising at least a metal layer.
14. A flexible printed circuit board comprising the polyimide film according to claim 9 as a base film.
15. The polyimide film according to claim 2 , wherein the difference between the maximum and the minimum of the molecular orientation angle of the polyimide film is 40° or less across the entire width.
16. The polyimide film according to claim 2 , wherein when the transferring direction (MD direction) during the continuous production is defined as 0°, the molecular orientation angle is within 0±20°.
17. The polyimide film according to claim 3 , wherein when the transferring direction (MD direction) during the continuous production is defined as 0°, the molecular orientation angle is within 0±20°.
18. A laminate comprising the polyimide film according to claim 4 .
19. A laminate comprising the polyimide film according to claim 5 .
20. The polyimide film according to claim 10 , wherein when the transferring direction (MD direction) during the continuous production is defined as 0°, the molecular orientation angle of the polyimide film is within 0±20° across the entire width.