Composition, film and producing method therefor
View Patent ↗A composition comprising: a polymerized substance of a compound (I) that contains m numbers of RSi(O 0.5 ) 3 units, wherein m represents an integer of from 8 to 16; and R's each independently represents a non-hydrolysable group, provided that at least two among R's represent groups containing a vinyl group or an ethynyl group, and wherein each one of the RSi(O 0.5 ) 3 units is connected to another one of the RSi(O 0.5 ) 3 units by sharing an oxygen atom in each one of the RSi(O 0.5 ) 3 units, so as to form a cage structure, and wherein within a solid component contained in the composition, a polymerized substance formed by a reaction of the compound (I) represents 60 mass % or more.
1. A composition comprising:
a polymerized substance of a compound (I), wherein the compound (I) contains m numbers of RSi(O 0.5 ) 3 units,
wherein m represents an integer of from 8 to 16; and
each R independently represents a non-hydrolysable group, provided that at least two among the R groups represent groups which contain a vinyl group or an ethynyl group, and
wherein each one of the RSi(O 0.5 ) 3 units is connected to another RSi(O 0.5 ) 3 unit by sharing an oxygen atom with the RSi(O 0.5 ) 3 unit, so as to form a cage structure, and
a surfactant in an amount of from 0.01 to 1 mass % with respect to the entire amount of the composition,
wherein within a solid component contained in the composition, a polymerized substance formed by a reaction of the compound (I) represents 60 mass % or more, and
wherein the surfactant has a structure that includes the following chemical formula:
wherein R 1 represents a hydrogen atom or an alkyl group containing 1 to 5 carbon atoms;
x represents an integer of from 1 to 20; and m and n each independently represents an integer of from 2 to 100; in which each R 1 may be the same or different.
2. The composition according to claim 1 ,
wherein a part of the solid component contained in the composition, remaining after elimination of the compound (I) on a GPC chart of the solid component, has a polystyrene- converted number-average molecular weight of from 3,000 to 300,000.
3. The composition according to claim 1 ,
wherein a part of the solid component contained in the composition, remaining after elimination of the compound (I) on a GPC chart of the solid component, has a polystyrene-converted weight-average molecular weight of from 7,000 to 1,000,000.
4. The composition according to claim 1 , which further comprises an organic solvent.
5. An insulating film forming composition comprising a composition according to claim 1 .
6. A film producing method comprising:
coating an insulating film forming composition according to claim 5 on a substrate; and
curing the coated composition.
7. A film which is produced by a film producing method according to claim 6 .
8. A semiconductor device comprising a film according to claim 7 .
9. A film forming composition comprising:
at least one of: compound (I) that contains m numbers of RSi(O 0.5 ) 3 units, wherein m represents an integer of from 8 to 16; and each R independently represents a non-hydrolysable group, and wherein each one of the RSi(O 0.5 ) 3 units is connected to another RSi(O 0.5 ) 3 unit by sharing an oxygen atom with the RSi(O 0.5 ) 3 unit, so as to form a cage structure; or a reaction product of the compound (I);
an organic solvent, and
a surfactant in an amount of from 0.01 to 1 mass% with respect to the entire amount of the composition,
wherein at least one among the groups represented by R is a group represented by formula (II):
(R 1 ) 3 —Si—O— (II)
wherein each R 1 independently represents a non-hydrolysable group, and at least two among the groups represented by R 1 within a molecule are groups containing a vinyl group.
10. The film forming composition according to claim 9 ,
wherein at least two among the groups represented by R are groups containing a vinyl group.
11. A method for producing an insulating film, which comprises:
coating a film forming composition according to claim 9 on a substrate; and
curing the coated composition.
12. An insulating film which is produced by utilizing a composition according to claim 9 .
13. The film forming composition according to claim 9 , wherein the surfactant has a structure that includes the following chemical formula:
wherein R 1 represents a hydrogen atom or an alkyl group containing 1 to 5 carbon atoms;
x represents an integer of from 1 to 20; and m and n each independently represents an integer of from 2 to 100; in which each R 1 may be the same or different.
14. A film forming composition comprising:
at least one of: a compound (I) that contains m numbers of RSi(O 0.5 ) 3 units, wherein m represents an integer of from 8 to 16; and each R independently represents a non-hydrolysable group, and wherein each one of the RSi(O 0.5 ) 3 units is connected to another RSi(O 0.5 ) 3 unit by sharing an oxygen atom with the Rsi(O 0.5 ) 3 unit, so as to form a cage structure; or a reaction product of the compound (I);
an organic solvent, and
a surfactant in an amount of from 0.01 to 1 mass% with respect to the entire amount of the composition,
wherein the surfactant has a structure that includes the following chemical formula:
wherein R 1 represents a hydrogen atom or an alkyl group containing 1 to 5 carbon atoms;
x represents an integer of from 1 to 20; and m and n each independently represents an integer of from 2 to 100; in which each R 1 may be the same or different.
15. A method for producing an insulating film, which comprises:
coating a film forming composition according to claim 14 on a substrate; and
curing the coated composition.
16. An insulating film which is produced by utilizing a composition according to claim 14 .