Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
View Patent ↗A laser processing apparatus is provided. The laser processing apparatus removes and extracts debris generated by irradiating a transparent resin layer formed on a substrate with laser light during a patterning process, and includes a debris extraction module provided on the upper side of the substrate, wherein the debris extraction module sucks and extracts debris due to sublimation, thermal processing and composite action thereof generated from the transparent resin layer on the substrate irradiated with the laser light from the lower side thereof.
1. A laser processing method comprising the steps of:
irradiating a transparent resin layer with laser light that passes through a transparent substrate, the transparent resin layer being formed on a first side of the transparent substrate; and
extracting debris generated by irradiating the transparent resin layer with a debris extraction module provided on the first side of the transparent substrate.
2. The laser processing method according to claim 1 , further comprising the step of:
forming a thin film on the transparent resin layer, the thin film absorbing color of a wavelength of the laser light.
3. The laser processing method according to claim 2 , further comprising the step of:
defocusing the laser light on the thin film.
4. The laser processing method according to claim 3 , further comprising the step of:
forming a pattern edge in the thin film, the pattern edge having a cross sectional shape of a section of an inverted cone.
5. The laser processing method according to claim 4 , wherein the pattern edge formed in the thin film has a cross sectional shape of a section of an inverted cone pointing toward the transparent substrate.
6. The laser processing method according to claim 4 , wherein the pattern edge formed in the thin film has a cross sectional shape of a section of an inverted cone pointing away from the transparent substrate.
7. The laser processing method according to claim 1 , wherein the transparent resin layer is formed directly on the transparent substrate.
8. The laser processing method according to claim 2 , wherein the thin film is a black resin layer.
9. The laser processing method according to claim 2 , wherein the transparent resin is formed of a first resin material.
10. The laser processing method according to claim 9 , wherein the thin film is formed of a second resin material.
11. The laser processing method according to claim 1 , further comprising the step of:
forming a thin film between the transparent resin layer and the transparent substrate, the thin film absorbing color of a wavelength of the laser light.
12. The laser processing method according to claim 11 , wherein the thin film is formed directly on the transparent substrate.
13. The laser processing method according to claim 11 , wherein the transparent resin layer is formed directly on the thin film.
14. The laser processing method according to claim 3 , wherein the thin film is a black resin layer.
15. The laser processing method according to claim 11 , wherein the transparent resin is formed of a first resin material.
16. The laser processing method according to claim 15 , wherein the thin film is formed of a second resin material.
17. A debris extraction method comprising the steps of:
irradiating a transparent resin layer with laser light that passes through a transparent substrate, the transparent resin layer being formed on a first side of the transparent substrate; and
extracting debris generated by irradiating the transparent resin layer with a debris extraction module provided on the first side of the transparent substrate.