Image display and manufacturing method thereof having particular internal wiring structure
View Patent ↗An image display in which a resistance value of internal wiring for inputting a signal and a power supply to a driving IC COG-packaged on an insulating substrate composing a display panel is reduced without enlarging external size of the display panel, and a method of manufacturing the image display. In internal wiring 8 for inputting a signal and a power supply to a driving IC 4 COG-packaged on a first insulating substrate 1, first layer internal wiring 8 a is composed of a first conductive film forming a scanning line, etc., and second layer internal wiring 8 b is composed of a second conductive film forming a signal line, etc. Connecting wiring 15 for connecting the first layer internal wiring 8 a and the second layer internal wiring 8 b is formed simultaneously with formation of a display electrode, and the internal wiring 8 is formed into a multi-layer structure connected electrically parallel.
1. An image display comprising:
a driving IC for driving an image display portion and packaged on an insulating substrate where said image display portion is formed; and
internal wiring for inputting a signal and a power supply from an external circuit to said driving IC,
wherein at least a part of said internal wiring has a multi-layer structure in which conductive films of different layers are connected so as to be electrically parallel to each other,
wherein said internal wiring includes power-supply input internal wiring for inputting a power supply to the driving IC and signal input internal wiring for inputting a signal, said power-supply input internal wiring has a multi-layer structure in which conductive films of different layers are connected so as to be electrically parallel to each other, and said signal input internal wiring has a single-layer structure in which a conductive film is not connected to any conductive film of a different layer,
the image display further comprising an opposed substrate that is opposed to said image display portion on said insulating substrate, wherein said internal wiring has a single-layer structure in which a conductive film is not connected to any conductive film of a different layer in an area where said insulating substrate and said opposed substrate overlap each other, and has a multi-layer structure in which conductive films of different layers are connected so as to be electrically parallel to each other in the area where said insulating substrate and said opposed substrate do not overlap each other.