IP Library Granted Patent US 7,589,284
Granted Patent B2
US 7,589,284 · App. 11/519,345 · Granted Sep 15, 2009

Composite polymeric material for EMI shielding

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Quick Facts
Patent No.
US 7,589,284
App. No.
11/519,345
Granted
Sep 15, 2009
Kind
B2
Abstract

An EMI shielding material is provided for making EMI shielding gaskets, coating and other articles. The EMI shielding material includes a non-conductive polymer, an inherently conductive polymer and a conductive metal powder. These components are intimately combined to prepare EMI shielding materials having superior electrical and mechanical performance when used in applications such as housings for electronic components.

Claims (23)

1. An EMI shielding material comprising:

an intimate admixture of a non-conductive elastomer polymer selected from the group consisting of silicone, urethane, flexible epoxy, polystyrene, PC, ABS, PC/ABS alloys, PBT, nylon, and mixtures thereof, and an inherently conductive polymer; and

an electrically conductive filler;

wherein said material can be shaped in a desired form to provide EMI shielding characteristics.

2. The EMI shielding material as claimed in claim 1 formed into an EMI shielding article.

3. The EMI shielding material as claimed in claim 1 wherein the EMI shielding material is a flexible EMI shielding gasket.

4. A housing for electronic components comprising the EMI shielding gasket as claimed in claim 3 .

5. The EMI shielding material as claimed in claim 1 wherein the EMI shielding material is a coating.

6. The EMI shielding material of claim 5 used for coating an enclosure housing an electronic circuit.

7. The EMI shielding material as claimed in claim 1 wherein the inherently conductive polymer is polyaniline.

8. The EMI shielding material as claimed in claim 1 wherein the non-conductive polymer is polystyrene.

9. The EMI shielding material as claimed in claim 1 wherein the non-conductive polymer and inherently conductive polymer are combined in proportions and under conditions to present the formation of a macro-phase of either polymer.

10. The EMI shielding material as claimed in claim 1 wherein the electrically conductive filler is a powder or fiber, or combination thereof.

11. The EMI shielding material as claimed in claim 10 wherein the electrically conductive filler is selected from the group consisting of nickel plated carbon, carbon, silver powder, copper powder, silver/copper powder, silver/aluminum powder, silver plated glass spheres, and nickel powder.

12. The EMI shielding material as claimed in claim 11 wherein the conductive filler is selected from the group consisting of silver powder, copper powder, silver/copper powder, silver/aluminum powder, silver plated glass spheres, nickel powder and nickel plated carbon fiber.

13. An EMI shielding material comprising:

an intimate admixture of a non-conductive elastomer polymer selected from the group consisting of silicone, urethane, flexible epoxy, polystyrene, PC, ABS, PC/ABS alloys, PBT, nylon, and mixtures thereof, and an inherently conductive polymer; and

an electrically conductive filler dispersed in the admixture forming a blend, the filler constituting between 1% and about 50% by weight of the blend;

wherein the EMI shielding material is formed into a shielding gasket or coating.

14. An EMI shielding material comprising:

an intimate admixture of a non-conductive elastomer polymer selected from the group consisting of silicone, urethane, flexible epoxy, polystyrene, PC, ABS, PC/ABS alloys, PBT, nylon, and mixtures thereof, and an inherently conductive polyaniline polymer; and

an electrically conductive filler;

wherein said material can be shaped in a desired form to provide EMI shielding characteristics.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2018
From: PARKER-HANNIFIN CORPORATION
To: PARKER INTANGIBLES, LLC
Reel/Frame 045843/0859 →