RFID device and method of making
View Patent ↗A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.
1. A radio frequency identification (RFID) device comprising:
a substrate;
a patterned conductive layer on the substrate;
a strap; and
at least one crimped electrical connection between the strap and the patterned conductive layer;
wherein the at least one crimped connection passes through the substrate.
2. The device of claim 1 , wherein the patterned conductive layer and the strap are on opposite respective sides of the substrate.
3. The device of claim 1 , wherein the patterned conductive layer and the strap are on the same side of the substrate.
4. The device of claim 1 , wherein the at least one crimped connection includes a rod that passes through the substrate.
5. The device of claim 4 , wherein the rod has a pair of bent ends, one of which is in contact with a seed layer that is part of the conductive pattern, and the other of which is in contact with a conductive lead of the strap.
6. The device of claim 5 , wherein the crimped connection also includes subsequently plated material.
7. The device of claim 6 , wherein the plated material is continuously coupled to plated material that is at least part of the patterned layer.
8. The device of claim 5 , wherein the seed layer is a metal layer.
9. The device of claim 5 , wherein the seed layer is a conductive ink layer.
10. The device of claim 1 , wherein the crimped connection includes conductive material displaced from a conductive lead of the strap.
11. The device of claim 10 , wherein the crimped connection also includes subsequently plated material.
12. The device of claim 11 , wherein the plated material is continuously coupled to plated material that is at least part of the patterned layer.
13. The device of claim 8 , wherein the displaced conductive material includes crowns of conductive material.
14. The device of claim 1 , wherein the patterned conductive layer includes an antenna.
15. The device of claim 1 , wherein the strap includes a chip coupled to the conductive leads.
16. The device of claim 1 , wherein the substrate is made of a flexible polymeric material.
17. The device of claim 1 , wherein at least part of the strap is within a hole in the substrate.
18. The device of claim 1 , wherein the crimped connection also includes subsequently plated material added after making of the electrical connection between the strap and the patterned conductive layer.
19. The device of claim 18 , wherein the subsequently plated material fills a hole in the at least one crimped connection.
20. The device of claim 18 , wherein the subsequently plated material fills gaps in the at least one crimped connection.