Lamination and delamination technique for thin film processing
This invention discloses a releasable adhesion layer having good adhesion during high temperature fabrication process in the absence of light, and delaminating at a lower temperature in the presence of light. One embodiment of this invention is a film of polymer whose thermal decomposition temperature changes drastically upon photoexposure. These materials, prior to photoexposure, can withstand temperatures in the range of approximately 200° C. to 300° C. without decomposition, yet decompose at around 100° C. with photoexposure. The releasable adhesion layer can be used in a thermal transfer element, sandwiching a donor substrate and a transfer layer having a plurality of multicomponent transfer units. In the absence of light, the releasable adhesion layer can sustain high temperature processing of these multicomponent transfer units. By photoexposing according to a pattern, the photoexposed multicomponent transfer units can be selectively released at a low temperature to transfer to a receptor.
1 . A device disposed on a receptor substrate, formed by transferring a multicomponent transfer unit from a thermal transfer element to the receptor substrate, using releasable adhesion layers that do not contamination the transferred device since they decompose completely and leave no detectable residue.
2 . A device as in claim 1 wherein the releasable adhesion layer comprising a polymer composition
having a low delamination temperature in the presence of light, whereby allowing the delamination of the adhesion layer to transfer the selected multicomponent units by exposing the selected multicomponent units to light; and
maintaining good adhesion between the donor substrate and the transfer layer at a temperature higher than the delamination temperature in the absence of light, whereby permitting processing the multicomponent transfer units at a temperature higher than the delamination temperature.
3 . A device as in claim 1 wherein the thermal transfer element comprises a donor substrate and a transfer layer with a releasable adhesion layer disposed between the donor substrate and the transfer layer.
4 . A device as in claim 1 , wherein the device is an organic electroluminescent device, an organic transistor, or an organic laser.
5 . A device as in claim 1 , wherein the device comprises a component in electronic circuitry, an electronic device, a thin film transistor device, a memory device, or a display device.
6 . A device as in claim 1 , wherein the device is in electrical contact with other existing devices on the receptor.
7 . A device as in claim 1 , wherein the receptor receiving surface comprises a releasable adhesion layer to form a thermal transfer element.
8 . A circuit comprising a plurality of thin film transistor devices disposed on a receptor substrate, at least one of the thin film transistor device formed by transferring a multicomponent transfer unit from a thermal transfer element to the receptor substrate using releasable adhesion layers that do not contamination the transferred device since they decompose completely and leave no detectable residue.
9 . A circuit as in claim 8 wherein the releasable adhesion layer comprising a polymer composition
having a low delamination temperature in the presence of light, whereby allowing the delamination of the adhesion layer to transfer the selected multicomponent units by exposing the selected multicomponent units to light; and
maintaining good adhesion between the donor substrate and the transfer layer at a temperature higher than the delamination temperature in the absence of light, whereby permitting processing the multicomponent transfer units at a temperature higher than the delamination temperature.
10 . A circuit as in claim 8 wherein the thermal transfer element comprises a donor substrate and a transfer layer with a releasable adhesion layer disposed between the donor substrate and the transfer layer.
11 . A circuit as in claim 8 , wherein the circuit comprises a memory device or a portion of a memory device, or a logic device or a portion of a logic device.
12 . A circuit as in claim 8 , wherein the receptor substrate comprises a memory device or a portion of a memory device, or a logic device or a portion of a logic device.
13 . A circuit as in claim 8 , wherein the circuit and the receptor each comprises a portion of a memory or logic device, and together form a complete memory or logic device.
14 . A circuit as in claim 8 , wherein the circuit comprises a plurality of first electrodes of a cross bar memory device and the receptor comprises a plurality of second electrodes of a cross bar memory device, and together form a complete cross bar memory device.
15 . A display comprising a plurality of components disposed on a receptor substrate, at least one of the components formed by transferring a multicomponent transfer unit from a thermal transfer element to the receptor substrate using releasable adhesion layers that do not contamination the transferred device since they decompose completely and leave no detectable residue.
16 . A display as in claim 15 wherein the releasable adhesion layer comprising a polymer composition
having a low delamination temperature in the presence of light, whereby allowing the delamination of the adhesion layer to transfer the selected multicomponent units by exposing the selected multicomponent units to light; and
maintaining good adhesion between the donor substrate and the transfer layer at a temperature higher than the delamination temperature in the absence of light, whereby permitting processing the multicomponent transfer units at a temperature higher than the delamination temperature.
17 . A display as in claim 15 wherein the thermal transfer element comprises a donor substrate and a transfer layer with a releasable adhesion layer disposed between the donor substrate and the transfer layer.
18 . A display as in claim 15 , wherein the components of the display comprises a memory or logic device or a portion of a memory or logic device.
19 . A display as in claim 15 , wherein the receptor substrate comprises a memory or logic device or a portion of a memory or logic device.
20 . A display as in claim 15 , wherein the components of the display and the receptor each comprises a portion of a memory or logic device, and together form a complete memory or logic device.