Process for forming low defect density heterojunctions
View Patent ↗A method for forming a low defect density heterojunction between a first and a second compound, the first and second compounds each includes a group III element combined with a group V element in the periodic table, the method includes the steps of introducing in the deposition chamber the flux of the group III element for the first compound at substantially the same time while introducing in the deposition chamber a flux of the group V element for the second compound, stopping the flux of the group III element for the first compound after a first predetermined time period, stopping the flux of the group V element for the first compound after a second predetermined time period, and introducing in the deposition chamber a flux of the group III element the group V element for the second compound.
1. A method for forming a low defect density heterojunction between a first and a second compound, the first and second compounds each includes a group III element combined with a group V element in the periodic table, the method comprising:
introducing in a molecular beam epitaxy deposition chamber a flux of the group III and V elements for the first compound to form a first single layer consisting of the group III and V elements for the first compound, the first single layer having a first top surface comprising the group III and V elements for the first compound;
stopping the flux of the group III element for the first compound after a first predetermined time period while continuing the flux of the group V element for the first compound to form a group V layer on the first top surface comprising the group III and V elements for the first compound;
stopping the flux of the group V element for the first compound after a second predetermined time period, to form a second top surface comprising the group V element for the first compound;
introducing simultaneously in the molecular beam epitaxy deposition chamber a flux of the group III element and the group V element for the second compound to form a second single layer consisting of the group III and V elements for the second compound on the second top surface comprising the group V element for the first compound; and
stopping the flux of the group III and V elements for the second compound after a third predetermined time period.
2. The method of claim 1 , wherein the group III element for the first compound is indium (In).
3. The method of claim 1 , wherein the group V element for the second compound is antimony (Sb).
4. The method of claim 1 , wherein the group V element for the first compound is arsenic (As).
5. The method of claim 1 , wherein the group III element for the second compound is aluminum (Al) or gallium (Ga).
6. The method of claim 1 , wherein the heterojunction between the first and second compounds is unforced.
7. A method for forming a low defect density heterojunction between a first and a second semiconductor compound, the first semiconductor compound includes a first and a second element, the second semiconductor compound includes a third and a fourth element, the first and third elements are selected from a group consisting essentially of group I, group II, group III, and group IV elements of the periodic table, and the second and fourth elements are selected from a group consisting essentially of group V, group VI, and group VII elements of the periodic table, the method comprising the steps of:
introducing in a molecular beam epitaxy deposition chamber a flux of the first and second elements for the first semiconductor compound during at least one overlapping time to form a first semiconductor compound layer, the first semiconductor compound layer having a first top surface comprising the first and second elements for the first semiconductor compound;
stopping the flux of the first element for the first semiconductor compound after a first predetermined time period while continuing the flux of the second element for the first semiconductor compound to form a second element layer on the first top surface comprising the first and second elements for the first semiconductor compound;
stopping the flux of the second element for the first semiconductor compound after a second predetermined time to form a second top surface comprising the second element for the first semiconductor compound;
introducing simultaneously in the molecular beam epitaxy deposition chamber a flux of the third and fourth elements for the second semiconductor compound to form a second semiconductor compound layer on the second top surface comprising the second element for the first semiconductor compound; and
stopping the flux of the third and fourth elements for the second semiconductor compound after a third predetermined time period has lapsed.
8. The method of claim 7 , wherein the first element for the first semiconductor compound is indium (In).
9. The method of claim 7 , wherein the second element for the first semiconductor compound is arsenic (As).
10. The method of claim 7 , wherein the fourth element for the second semiconductor compound is antimony (Sb).
11. The method of claim 7 , wherein the third element for the second semiconductor compound is aluminum (Al).
12. The method of claim 7 , wherein the third element for the second semiconductor compound is gallium (Ga).
13. A method for forming a low defect density heterojunction between a first and a second compound, the first and second compounds each includes a group III element combined with a group V element in the periodic table, the method comprising:
(a) introducing in a molecular beam epitaxy deposition chamber a flux of the group III and V elements for the first compound to form a first single compound layer consisting of the group III and V elements for the first compound, the first single compound layer having a first top surface comprising the group III and V elements for the first compound;
(b) stopping the flux of the group III element for the first compound after a first predetermined time period while continuing the flux of the group V element for the first compound to form a group V layer on the first top surface comprising the group III and V elements for the first compound;
(c) stopping the flux of the group V element for the first compound after a second predetermined time period, to form a second top surface comprising the group V element for the first compound;
(d) introducing simultaneously in the molecular beam epitaxy deposition chamber a flux of the group III element and the group V element for the second compound to form a second single layer consisting of the group III and V elements for the second compound on the second top surface comprising the group V element for the first compound; and
(e) stopping the flux of the group III and V elements for the second compound after a third predetermined time period.
14. The method of claim 13 , wherein the group III element for the first compound is indium (In).
15. The method of claim 13 , wherein the group V element for the second compound is antimony (Sb).
16. The method of claim 13 , wherein the group V element for the first compound is arsenic (As).
17. The method of claim 13 , wherein the group III element for the second compound is aluminum (Al) or gallium (Ga).
18. The method of claim 13 , wherein the heterojunction between the first and second compounds is unforced.