IP Library › Granted Patent US 7,279,356
Granted Patent B2
US 7,279,356 · App. 11/523,153 · Granted Oct 9, 2007

Depopulation of a ball grid array to allow via placement

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Quick Facts
Patent No.
US 7,279,356
App. No.
11/523,153
Granted
Oct 9, 2007
Kind
B2
Abstract

The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid array having open spaces therein. Within the open spaces, pairs of opposite polarity vias are clustered to minimize current path inductance by exploiting mutual inductance between vias of opposite current flow. In an illustrative embodiment, capacitors are coupled to the vias to further reduce current path inductance.

Claims (18)

1. A method for improving the functionality of an integrated circuit, comprising:

providing a substrate having a first surface and a second surface;

providing a ball grid array of electrically conductive balls affixed to said first surface of said substrate, said array having a first density of balls and a first open space therein, said first open space having a second density of balls which is less than the first density of balls; and

mounting an integrated circuit (IC) package on the first surface of the substrate using at least a portion of the electrically conductive balls.

2. A method for improving the functionality of an integrated circuit, comprising:

providing a substrate having a first surface and a second surface;

providing a ball grid array of electrically conductive balls affixed to said first surface of said substrate, said array having a first density of balls and a first open space therein, said first open space having a second density of balls which is less than the first density of balls;

positioning at least one via pair within said first open space, said via pair including a first via and a second via, said first via having a current flow opposite that of said second via; and

mounting an integrated circuit (IC) package on the first surface of the substrate using at least a portion of the electrically conductive balls.

3. A method for improving the functionality of an integrated circuit comprising:

providing a substrate having a first surface and a second surface;

providing a ball grid array of electrically conductive balls affixed to said first surface of said substrate, said array having a first density of balls and a first open space therein, said first open space having a second density of balls which is less than the first density of balls; and

mounting an integrated circuit (IC) package on the first surface of the substrate using at least a portion of the electrically conductive balls, wherein said ball pitch is approximately 1.0 mm.

4. A method for improving the functionality of an integrated circuit as recited in claim 3 wherein said approximately is in the range of 0.2 mm to 2.0 mm.

5. A method of improving the functionality of an integrated circuit as recited in claim 2 wherein said second density of balls ranges from zero to at least one.

6. A method of improving the functionality of an integrated circuit as recited in claim 2 wherein distance between vias of opposite direction current flow is less than a distance between vias of like direction current flow.

7. A method for improving the functionality of an integrated circuit as recited in claim 2 , further comprising;

coupling one or more capacitors to a first via and to a second via.