High thermal conductivity dielectric tape
View Patent ↗An electrical insulation tape that has a first and second carrier layer, and a dielectric thermally conductive, electrically insulative filler layer ( 24 ) that has mica particles/flakelets ( 6 ), filler particles ( 26 ) and a binder resin ( 28 ), disposed between the first and second carrier layers. The dielectric filler layer has mica flakelets ( 30 ), filler particles ( 32 ) and a binder resin. The ratio of mica flakelets to filler particles is at least 1:1 by volume, and the percentage of binder resin in the dielectric filler layer is 35-50% by volume. The first and second carrier layers are impregnated with a second resin.
1. An electrical insulation tape comprising:
a first and second carrier layers; and
a dielectric filler layer disposed between said first and said second carrier layers;
wherein said dielectric filler layer comprises mica flakelets, filler particles and a binder resin;
wherein the ratio of said mica flakelets to said filler particles is at least 1:1 by volume;
wherein the percentage of said binder resin in said dielectric filler layer is 25-50% by volume;
wherein said first and said second carrier layers are impregnated with a second resin, wherein said second resin is a thermoset polymeric resin;
wherein said filler particles comprise at least one of ZnO, BeO and SiC; and
wherein said filler particles have a length of between 1-100,000 nm and an aspect ratio of approximately 5-50.
2. The electrical insulation tape according to claim 1 , wherein said second resin is a b-stage resin.
3. The electrical insulation tape according to claim 1 , wherein said carrier layers are glass fabric.
4. The electrical insulation tape according to claim 1 , wherein said filler particles are discoids and platelets.
5. The electrical insulation tape according to claim 1 , wherein said filler particles have been surface treated to introduce surface functional groups that allow for the essentially complete co-reactivity with said binder resin.
6. The electrical insulation tape according to claim 5 , wherein said functional groups comprise at least one of hydroxyl, carboxylic, amine, epoxide, silane and vinyl groups.
7. The electrical insulation tape according to claim 1 , wherein said binder resin includes epoxy, polyimide epoxy, liquid crystal epoxy or cyanate-ester.
8. An electrical insulation tape comprising:
a first and a second glass fabric layer; and
a dielectric filler layer disposed between said first and said second glass fabric layers;
wherein said dielectric filler layer comprises mica flakelets, thermally conductive filler particles and a binder resin;
wherein the ratio of said mica flakelets to said filler particles is at least 1:1 by volume;
wherein the percentage of said binder resin in said filler layer is 25-50% by volume;
wherein said first and said second glass fabric layers are pre-impregnated with a second thermoset polymeric resin;
wherein the thermally conductive filler particles further comprise particles of an inorganic material coated with a material exhibiting a higher thermal conductivity than that of the inorganic material.
9. The electrical insulation tape according to claim 8 , wherein said second thermoset polymeric resin is a b-stage resin.
10. The electrical insulation tape of claim 8 , wherein the inorganic material comprises silica.
11. The electrical insulation tape of claim 8 , wherein the material exhibiting a higher thermal conductivity than that of the inorganic material comprises at least one of ZnO, BeO and SiC.