IP Library Granted Patent US 7,320,924
Granted Patent B2
US 7,320,924 · App. 11/523,417 · Granted Jan 22, 2008

Method of producing a chip-type solid electrolytic capacitor

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Quick Facts
Patent No.
US 7,320,924
App. No.
11/523,417
Granted
Jan 22, 2008
Kind
B2
Abstract

A chip-type solid electrolytic capacitor comprises capacitor elements. A cathode terminal comprising a plate-like conductor is interposed between cathode layers of the capacitor elements. The capacitor elements are bonded to each other by a bonding agent such as a solder or a conductive adhesive. The cathode terminal is provided with a through hole formed at a portion to be brought into contact with each of the capacitor elements. Bonding surfaces of the capacitor elements are directly connected at the through hole.

Claims (8)

1. A method of producing a chip-type solid electrolytic capacitor, comprising:

producing a plurality of capacitor elements, each one of the capacitor elements being produced by: (i) obtaining an anode member by sintering a valve metal such that an anode lead is connected to the anode member, (ii) forming a dielectric oxide layer on the anode member, and (iii) forming a cathode layer on the dielectric oxide layer;

laminating the plurality of capacitor elements with at least one cathode terminal positioned between two capacitor elements such that the cathode layers of the two capacitor elements face each other via the cathode terminal, said cathode terminal having at least one of a through hole and a cutout formed therein;

filling a bonding agent at an interface between each of the cathode layers and the cathode terminal and in said at least one of the through hole and the cutout, so as to bond the capacitor elements together; and

electrically connecting the capacitor elements in parallel.

2. A method according to claim 1 , wherein the capacitor elements are produced and laminated such that the respective anode leads of the capacitor elements are spaced from one another in a direction perpendicular to bonding surfaces of the capacitor elements.

3. A method according to claim 1 , wherein the through hole has one of: a circular shape, a rectangular shape, and another polygonal shape.

4. A method according to claim 2 , wherein the through hole has one of: a circular shape, a rectangular shape, and another polygonal shape.

Assignments (1)
CHANGE OF NAME Recorded Jun 19, 2017
From: NEC TOKIN CORPORATION
To: TOKIN CORPORATION
Reel/Frame 042879/0135 →