Semiconductor package

1. A semiconductor package, comprising:

a substrate having a plurality of conductive pads disposed on at least one major surface thereof;

a bidirectional compound semiconductor component having at least a first power electrode electrically and mechanically connected to a respective conductive pad and a second power electrode electrically and mechanically connected to a respective conductive pad;

a first power semiconductor device having a first power electrode electrically connected to said first power electrode of said compound semiconductor component, and a second power electrode electrically and mechanically connected to at least one conductive pad;

second power semiconductor having a first power electrode electrically connected to said second power electrode of said compound semiconductor component, and a second power electrode electrically and mechanically connected to at least one conductive pad;

wherein said bidirectional compound semiconductor component, said first power semiconductor device, and said second power semiconductor device are electrically connected within said package in a cascoded arrangement.

2. The package of claim 1 , wherein said first and said second power semiconductor devices are power MOSFETs and said bidirectional compound power semiconductor device is a III-nitride based bidirectional power semiconductor device.

3. The package of claim 1 , further comprising a first heatsink electrically connecting said first power electrode of said first power semiconductor device to said first power electrode of said compound semiconductor component, and a second heatsink electrically connecting said first power electrode of said second power semiconductor device to said second power electrode of said compound semiconductor component.

4. The package of claim 3 , wherein said first heatsink and said second heatsink are thermally coupled to said compound semiconductor component.

5. The package of claim 4 , further comprising a mold housing disposed around said first and second semiconductor devices and said compound semiconductor component.

6. The package of claim 5 , wherein said heatsinks are exposed through said mold housing.

7. The package of claim 5 , wherein said heatsinks are encapsulated in said mold housing.

8. A semiconductor package comprising:

a multichip circuit that includes a bidirectional compound semiconductor component, a first power semiconductor device and a second power semiconductor device wire-free-connected in a cascoded configuration; and

at least one heatsink thermally coupled to said compound semiconductor component and electrically connecting at least one of said power semiconductor devices to said compound semiconductor component.

9. The package of claim 8 , further comprising a mold housing.

10. The package of claim 9 , wherein said mold housing encapsulates said heatsink.

11. The package of claim 9 , wherein said heatsink is exposed through said mold housing.