Power semiconductor device with integrated passive component
View Patent ↗A power semiconductor device that includes a passive component, e.g., a capacitor, mechanically and electrically coupled to at least one pole thereof.
1. A power semiconductor device comprising:
a discreet power semiconductor switch having a first power electrode on one surface thereof; and
a capacitor on another surface instead of a power electrode, said capacitor having a first conductive plate directly mechanically and electrically coupled to the semiconductor body of said power semiconductor switch.
2. The power semiconductor device of claim 1 , wherein said power semiconductor switch is a power MOSFET.
3. The power semiconductor device of claim 1 , wherein said first conductive plate is directly mechanically and electrically coupled to the drain region of a power MOSFET.
4. The power semiconductor device of claim 1 , wherein said discreet power semiconductor device is configured for application in a driver circuit.
5. The power semiconductor device of claim 1 , wherein said device is configured for use in a predriver circuit.
6. The power semiconductor device of claim 1 , wherein said device is configured for use in a power circuit.
7. The power semiconductor device of claim 1 , wherein said capacitor is formed using drop-on-demand fabrication.
8. A power semiconductor device comprising:
a discreet power semiconductor switch;
a capacitor mechanically coupled to a major portion of said power semiconductor switch and having a first conductive plate, a second conductive plate and a dielectric body disposed between said first conductive plate and said second conductive plate, and wherein said power semiconductor switch includes a first power electrode and a second power electrode, wherein said first conductive plate is electrically connected to said first power electrode.
9. The power semiconductor device of claim 8 , further comprising a dielectric spacer disposed between said first power electrode and said first conductive plate serving to mechanically couple said first conductive plate to said first power electrode.
10. The power semiconductor device of claim 9 , wherein said first conductive plate is electrically connected to said first power electrode through a conductive filled via in said dielectric spacer.
11. The power semiconductor device of claim 9 , wherein said first conductive plate is electrically connected to said first power electrode through a plurality of conductive filled vias in said dielectric spacer.
12. The power semiconductor device of claim 8 , wherein said first power electrode is the source electrode of a power MOSFET.
13. The power semiconductor device of claim 8 , wherein said first power electrode is the drain electrode of a power MOSFET.