IP Library Granted Patent US 7,374,695
Granted Patent B2
US 7,374,695 · App. 11/525,860 · Granted May 20, 2008

Method of manufacturing an inkjet nozzle assembly for volumetric ink ejection

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Quick Facts
Patent No.
US 7,374,695
App. No.
11/525,860
Granted
May 20, 2008
Kind
B2
Abstract

A method is provided for manufacturing a printer nozzle. The method includes the step of depositing a metal layer upon a semi-conductor wafer. The metal layer defines a pair of protruding portions which each form a respective electrical contact. The method further includes the step of etching the metal layer through to the wafer to form a nozzle region and to electrically isolate the electrical contacts. In one embodiment, the nozzle region is defined by a circular wall.

Claims (20)

1. A method for manufacturing a printer nozzle assembly, the method comprising the steps of:

depositing a metal layer upon a semi-conductor wafer, the metal layer defining a pair of protruding portions which each form a respective electrical contact; and

etching the metal layer through to the wafer to form a nozzle region and to electrically isolate the electrical contacts.

2. A method as claimed in claim 1 , wherein the step of etching the metal layer is carried out so that the nozzle region is defined by a circular wall.

3. A method as claimed in claim 1 , further comprising the steps of:

depositing a polytetrafluoroethylene (PTFE) layer on the metal layer and the exposed wafer in the nozzle region; and

etching the PTFE layer so as to define a pair of apertures each in register with a respective electrical contact.

4. A method as claimed in claim 3 , further comprising the steps of:

depositing another metal layer on the PTFE layer; and

etching the other metal layer through to the PTFE layer to define a heater element superposed with respect to the nozzle region and having a pair of ends which are each coupled to a respective electrical contact through a corresponding aperture.

5. A method as claimed in claim 4 , wherein said other metal layer is etched so that the heater element defines a plurality of serially interconnected serpentine portions.

6. A method as claimed in claim 4 , further comprising the steps of:

depositing another PTFE layer on the other metal layer and the PTFE layer; and

etching the other PTFE layer to define:

a plurality of radially extending bridging portions which terminate in a common rim, and

a plurality of actuators which each extend between a respective pair of adjacent bridging portions and each terminate in a free end proximal to the rim.

7. A method as claimed in claim 6 , further comprising the step of:

etching the wafer to define a nozzle chamber with respect to which the rim, bridging portions and actuators are superposed.

8. A method as claimed in claim 7 , further comprising the step of:

etching through the wafer to define an ink supply channel at an apex of the nozzle chamber.

Assignments (2)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028568/0148 →