Method of fabricating display device and display device

1. A method of fabricating a display device having a TFT substrate and an array of light-emitting devices arranged on the substrate, each of the light-emitting devices having a lower electrode, an upper electrode, and organic layers sandwiched between the lower and upper electrodes, the method comprising:

forming the light-emitting devices at a display region of the TFT substrate;

forming external connector terminals outside the display region and keeping surfaces of the external connector terminals exposed while selectively applying a protective film over the display region of the TFT substrate, but not in another region of the TFT substrate by a method of application such that at least the light-emitting devices are covered by the protective film without applying the protective film to the exposed connector terminals and wherein the protective film as originally applied is a continuous film covering the array of light emitting devices and the protective film is an organic material containing fluorine, and further wherein the external connector terminals are located at openings formed in an insulating film on which the light-emitting devices are formed and wherein auxiliary interconnects are formed on the insulating film adjacent to the light-emitting devices.

2. The method of fabricating a display device as set forth in claim 1 , wherein the protective film is made of an organic material and a solvent, and whereby the protective film is applied via a coating method.

3. The method of fabricating a display device as set forth in claim 1 , wherein the step of selectively applying the protective film is followed by the steps of interposing encapsulating resin between a counter substrate and the TFT substrate and bonding together the TFT substrate and the counter substrate.

4. The method of fabricating a display device as set forth in claim 3 , wherein the step of interposing the encapsulating resin is carried out by forming a frame-like portion of a sealing agent only on fringe portions of the display region, applying a filler to a region within the frame-like portion of the sealing agent, and bringing together the TFT substrate and the counter substrate.

5. The method of fabricating a display device as set forth in claim 4 , wherein in the step of applying the protective film, the protective film is formed over the whole of the display region of the TFT substrate, and wherein in the step of interposing the encapsulating resin, the frame-like portion of the sealing agent is formed on fringe portions of the protective film or over a region of the counter substrate corresponding to the fringe portions of the protective film.

6. The method of fabricating a display device as set forth in claim 4 , wherein in the step of applying the protective film, the protective film is formed in a size (outermost bounds) smaller than the size (outermost bounds) of the display region of the TFT substrate, and wherein in the step of interposing the encapsulating resin, the frame-like portion of the sealing agent is formed outside the outer fringes of the protective film or over a corresponding region of the counter substrate corresponding to a position outside the outer fringes of the protective film.

7. A display device comprising:

an array of light-emitting devices formed at a display region of a substrate, each of the light-emitting devices having a lower electrode, an upper electrode, and organic layers sandwiched between the lower and upper electrodes;

external connector terminals connected to the light-emitting devices and disposed outside the display region; and

a continuous protective film formed only over the display region of the substrate by a method of application such that at least the light-emitting devices are covered the protective film not being applied to the exposed connector terminals and wherein the protective film as originally applied is a continuous film covering the array of light emitting devices and the protective film is an organic material containing fluorine, and further wherein the external connector terminals are located at openings formed in an insulating film on which the light-emitting devices are formed and wherein auxiliary interconnects are formed on the insulating film adjacent to the light-emitting devices.

8. The method of fabricating a display device as set forth in claim 1 , wherein said protective film is applied only over said display region of the TFT substrate.

9. The method of fabricating a display device as set forth in claim 1 , wherein said protective film has an optical transmittance in the blue wavelength range (400 to 450 nm) of over 90%.

10. The method of fabricating a display device as set forth in claim 1 , wherein said protective film is applied by an offset printing method.

11. The method of fabricating a display device as set forth in claim 5 , wherein said protective film is applied only over said display region of the TFT substrate.

12. The method of fabricating a display device as set forth in claim 5 , wherein said protective film has an optical transmittance in the blue wavelength range (400 to 450 nm) of over 90%.

13. The method of fabricating a display device as set forth in claim 5 , wherein said protective film is applied by an offset printing method.

14. The method of fabricating a display device as set forth in claim 6 , wherein said protective film is applied only over said display region of the TFT substrate.

15. The method of fabricating a display device as set forth in claim 6 , wherein said protective film has an optical transmittance in the blue wavelength range (400 to 450 nm) of over 90%.

16. The method of fabricating a display device as set forth in claim 6 , wherein said protective film is applied by an offset printing method.

17. The display device as set forth in claim 7 , wherein said protective film has an optical transmittance in the blue wavelength range (400 to 450 nm) of over 90%.

18. The display device as set forth in claim 7 , wherein said protective film is applied by an offset printing method.

19. The display device as set forth in claim 7 , wherein said protective film is formed over the entire the display region of the substrate.

20. The method of fabricating a display device as set forth in claim 1 , wherein the protective layer extends over an upper electrode that is over an auxiliary interconnect, the protective layer extending up to an upper surface of a second insulating layer formed over a first insulating within which connections to the light emitting devices are made.

21. The method of fabricating a display device as set forth in claim 20 , wherein the protective layer does not extend beneath a frame sealing structure that is formed on the second insulating layer.