Thermal interface device
View Patent ↗A thermal interface device ( 100 ) includes a base member ( 102 ) and a pocket ( 104 ) which is filled with a thermally conductive material or medium such as diamond dust suspended in a solvent such as propylene glycol or a thermally conductive material such as thermally conductive rubber. The pocket ( 104 ) is hermitically sealed to the base member ( 102 ) in order to keep the thermally conductive material within the pocket. The filled pocket ( 104 ) forms a deformable “pillow” having a high thermal conductance. The deformable pocket ( 104 ) can contour to the shape of a device it is pressed against such as an electronic device undergoing testing.
1. A thermal interface device, comprising:
a base member;
a pocket member coupled to the base member;
the pocket member is filled with a thermally conductive material; and the pocket member is hermitically sealed to the base member and the base member and pocket member are formed from silver foil.
2. A thermal interface device as defined in claim 1 ,
wherein the thermally conductive material comprises diamond dust mixed with a solvent.
3. A thermal interface device as defined in claim 1 , wherein the base member and pocket member are soldered together.
4. A thermal interface device as defined in claim 1 , wherein the pocket member is deformable.
5. A thermal interface device as defined in claim 1 , wherein the pocket member comprises a silver foil having a cupped section for storing the thermally conductive material.
6. A thermal interface device, comprising:
a base member;
a pocket member coupled to the base member;
the pocket member is filled with a thermally conductive material; and
A the thermally conductive material comprises nano-particle sized diamond dust in a propylene glycol solvent.
7. A thermal interface device as defined in claim 6 , wherein the base member and pocket member are formed from silver foil.
8. A thermal interface device as defined in claim 6 , wherein the pocket member has a substantially circular shape.
9. A thermal interface device as defined in claim 6 , wherein the thermally conductive material further comprises rubber particles.
10. A thermal interface device, comprising
a first silver foil member;
a second silver foil member;
the first and second silver foil members form a compressible sealed pocket; and
a thermally conductive mixture is located inside of the sealed pocket which is sealed to prevent the thermally conductive mixture from leaving the sealed pocket.
11. A thermal interface device as defined in claim 10 , wherein the thermally conductive mixture includes diamond dust and a liquid solvent.
12. A thermal interface device, comprising
a first silver foil member;
a second silver foil member;
the first and second silver foil members form a sealed pocket;
a thermally conductive mixture is located inside of the sealed pocket; and wherein the thermally conductive mixture includes diamond dust, a solvent and rubber particles.
13. A thermal interface device as defined in claim 12 , wherein the sealed pocket is filled with enough thermally conductive mixture to allow it to deform when pressed against an object.
14. A thermal interface device as defined in claim 13 , wherein the first and second silver foil members are soldered together to form the sealed pocket.
15. A thermal interface device; comprising:
a deformable pillow; and
a thermally conductive medium including a liquid located inside of the deformable pillow, the deformable pillow is sealed to prevent the liquid from escaping.
16. A thermal interface device as defined in claim 15 , wherein the deformable pillow is formed from two sheets of thermally conductive foil.
17. A thermal interface device as defined in claim 15 , wherein the thermally conductive medium is formed from a mixture of diamond dust suspended in a solvent.
18. A thermal interface device, comprising:
a thermally conductive compressible member;
thermally conductive material covering the thermally conductive compressible member; and wherein the thermally conductive compressible member comprises a thermally conductive rubber member.
19. A thermal interface device as defined in claim 18 , wherein the thermally conductive material further comprises thermally conductive foil.