Radiation emitting semiconductor chip
View Patent ↗A radiation-emitting semiconductor chip ( 1 ) comprising a thin-film semiconductor body ( 2 ) which has a semiconductor layer sequence with an active region ( 4 ) suitable for generating radiation, and a reflector layer ( 5 ) arranged on the thin-film semiconductor body. The semiconductor chip has a Bragg reflector in addition to the reflector layer, and the Bragg reflector ( 6 ) and the reflector layer are arranged on the same side of the active region.
1. A radiation-emitting semiconductor chip comprising:
a thin-film semiconductor body having a semiconductor layer sequence with an active region suitable for generating radiation;
a metallic reflector layer arranged on the thin-film semiconductor body;
a Bragg reflector; and
a semiconductor contact layer arranged between the metallic reflector layer and the Bragg reflector;
wherein the Bragg reflector and the metallic reflector layer are arranged on the same side of the active region for reflecting radiation generated in the active region,
wherein the semiconductor chip is constructed for generating incoherent radiation, and
wherein the semiconductor chip is free of a growth substrate.
2. The semiconductor chip as claimed in claim 1 , wherein the Bragg reflector is integrated monolithically in the semiconductor layer sequence of the thin-film semiconductor body.
3. The semiconductor chip as claimed in claim 1 , wherein the thin-film semiconductor body is arranged on a carrier and the metallic reflector layer is arranged between the carrier and the thin-film semiconductor body.
4. The semiconductor chip as claimed in claim 3 , wherein the Bragg reflector is arranged between the active region and the carrier.
5. The semiconductor chip as claimed in claim 1 , wherein the Bragg reflector is arranged between the active region and the metallic reflector layer.
6. The semiconductor chip as claimed in claim 3 , wherein the metallic reflector layer directly adjoins the carrier.
7. The semiconductor chip as claimed in claim 1 , wherein the metallic reflector layer directly adjoins the thin-film semiconductor body.
8. The semiconductor chip as claimed in claim 3 , wherein the thin-film semiconductor body is mounted on the carrier by means of the metallic reflector layer.
9. The semiconductor chip as claimed in claim 1 , wherein the metallic reflector layer is constructed to be electrically conductive.
10. The semiconductor chip as claimed in claim 1 , wherein the metallic reflector layer has a reflectivity of 90% or less for radiation to be generated in the active region.
11. The semiconductor chip as claimed in claim 10 , wherein the Bragg reflector has a reflectivity of 90% or less for radiation to be generated in the active region.
12. The semiconductor chip as claimed in claim 1 , wherein the semiconductor chip is operated in a resonator-free fashion.
13. The semiconductor chip as claimed in claim 1 , wherein the distance of the active region from the Bragg reflector is greater than the distance of the active region from a surface of the thin-film semiconductor body facing away from the Bragg reflector.
14. The semiconductor chip as claimed in claim 1 , wherein the metallic reflector layer is connected to the thin-film semiconductor body electrically conductively over a large area.
15. The semiconductor chip as claimed in claim 1 , wherein the Bragg reflector has a reflectivity of 90% or less for radiation to be generated in the active region.
16. The semiconductor chip as claimed in claim 10 , wherein at least one of the Bragg reflector and the metallic reflector layer have a reflectivity of at most 80%.
17. The semiconductor chip as claimed in claim 10 , wherein the metallic reflector layer has a reflectivity of 70% or greater for radiation generated in the active region.