IP Library Granted Patent US 7,537,149
Granted Patent B2
US 7,537,149 · App. 11/528,299 · Granted May 26, 2009

Deep access large ribbon bond head

Assignee: Orthodyne Electronics Corporation
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Quick Facts
Patent No.
US 7,537,149
App. No.
11/528,299
Granted
May 26, 2009
Kind
B2
Abstract

A ribbon bond head capable of deep access bonding is configured to pass the bonding ribbon outside the transducer, e.g., in front of the transducer, instead of through the transducer. A clamping mechanism includes a stationary flat clamp base and a movable clamp arm with an opening, where the bonding ribbon passes through, not around, the clamp arm. The ribbon is clamped between the movable clamp and the stationary clamp and held securely during looping.

Claims (18)

1. A ribbon bond head, comprising:

a main body;

a ribbon guide tube having a first end coupled to the main body and a second end coupled to a ribbon source, wherein the ribbon guide tube has an opening to enclose and pass through a conductive ribbon;

a transducer coupled to the main body;

an opening in the main body in front of the transducer, wherein the ribbon passes through the opening and in front of the transducer; and

a clamp coupled to the main body, wherein the clamp comprises:

a clamp arm having a width at least as wide as the ribbon; and

a stationary clamp base having a width at least as wide as the ribbon.

2. The bond head of claim 1 , wherein the clamp arm is movable.

3. The bond head of claim 1 , wherein the clamp arm has an opening through which the ribbon passes.

4. The bond head of claim 1 , wherein the clamp arm has a flat surface biased against an opposing flat surface on the stationary clamp base.

5. The bond head of claim 1 , wherein the opening in the ribbon guide tube is approximately rectangular.

6. The bond head of claim 1 , wherein the opening in the main body allows the ribbon to pass approximately 1 mm from the front of the transducer.

7. The bond head of claim 1 , wherein the clamp is coupled with the transducer.

8. The bond head of claim 1 , wherein the bonding ribbon is at least 2 mil thick.

9. The bond head of claim 1 , wherein the bonding ribbon is at least 20 mil wide.

10. The bond head of claim 1 , wherein the stationary clamp base has provisions for holding a ribbon guide which extends from the clamp base toward a bond tool.

11. The bond head of claim 10 , wherein the extension portion of the ribbon guide is narrowed to the approximate width of the bond tool.

Assignments (5)
MERGER Recorded Oct 25, 2018
From: ORTHODYNE ELECTRONICS CORPORATION
To: KULICKE AND SOFFA INDUSTRIES, INC.
Reel/Frame 047307/0545 →
CHANGE OF NAME Recorded Feb 5, 2018
From: KULICKE AND SOFFA WEDGE BONDING, INC.
To: ORTHODYNE ELECTRONICS CORPORATION
Reel/Frame 045249/0722 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2018
From: KULICKE AND SOFFA INDUSTRIES, INC.
To: KULICKE AND SOFFA WEDGE BONDING, INC.
Reel/Frame 044789/0783 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2018
From: ORTHODYNE ELECTRONICS CORPORATION
To: KULICKE AND SOFFA INDUSTRIES, INC.
Reel/Frame 044759/0195 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2006
From: COPPERTHITE, THEODORE J.
To: ORTHODYNE ELECTRONICS CORPORATION
Reel/Frame 018491/0097 →
Continuity (1)
Related Publication 20080073407A1 · Mar 27, 2008