Laser beam pattern mask and crystallization method using the same

1. A crystallization method, comprising the steps of:

preparing a substrate having an amorphous silicon layer deposited thereon;

fixing the substrate to a stage;

placing a laser beam pattern mask over the substrate, the laser beam pattern mask comprising at least one or more transmitting parts, each laser beam pattern including:

a rectangular central portion; and

a pair of edge portions provided to both sides of the central portion, each having a substantially triangular shape defined by a virtual boundary line between the central portion and the corresponding edge portion, an upper outside extending from an upper end of the boundary line at an acute angle, and a lower outside extending from a lower end of the boundary line at the acute angle to meet the upper outside at a rounded corner; and

performing a laser beam irradiation for crystallizing the amorphous silicon using the laser beam pattern mask by overlapping the central portion of a next irradiation with an irradiated portion corresponding to the edge portion exposed in a previous irradiation.

2. The crystallizing method of claim 1 , the laser beam irradiation performing step comprising:

a first step of performing a horizontal crystallization by moving the stage in a horizontal direction to a first distance;

a second step of moving the stage in a vertical direction to a second distance;

a third step of performing the horizontal crystallization by moving the stage to the first distance in a reverse direction of the horizontal direction of the first step; and

a fourth step of repeating the first to third steps.

3. The crystallizing method of claim 2 , wherein the first distance is about equal to a length of the central portion and the second distance is about equal to a width of the central portion.

4. A crystallization method, comprising the steps of:

preparing a substrate having an amorphous silicon layer deposited thereon;

fixing the substrate to a stage;

placing a laser beam pattern mask over the substrate, the laser beam pattern mask comprising:

at least one first transmitting part including:

a rectangular central portion; and

a pair of edge portions provided to both sides of the central portion, each having substantially triangular shape defined by a virtual boundary line between the central portion and the corresponding edge portion, an upper outside extending from an upper end of the boundary line at an acute angle, and a lower outside extending from a lower end of the boundary line at the acute angle to meet the upper outside at a rounded corner;

at least one second transmitting part separated from the at least one first transmitting part by a first distance in a horizontal direction equal to a length of the central part or a second distance in a vertical direction equal to width of the central part; and

performing a laser beam irradiation for crystallizing the amorphous silicon using the laser beam pattern mask by overlapping the central portion of a next irradiation with an irradiated portion corresponding to the edge portion exposed in a previous irradiation.

5. The crystallizing method of claim 4 , the laser beam irradiation performing step comprising:

a first step of performing a horizontal crystallization by moving the stage in a horizontal direction to a first distance;

a second step of moving the stage in a vertical direction to a second distance;

a third step of performing the horizontal crystallization by moving the stage to the first distance in a reverse direction of the horizontal direction of the first step; and

a fourth step of repeating the first to third steps.

6. The crystallizing method of claim 5 , wherein the first distance is about equal to a length of the central portion of the at least one first transmitting part and the second distance is about equal to a width of the central portion of the at least one second transmitting part.