Organic light emitting display device and method of fabricating the same

1. An organic light emitting display device, comprising:

a first substrate;

a second substrate comprising an interior surface opposing the first substrate;

an array of organic light emitting pixels formed between the first and second substrates, the array comprising a top surface facing the second substrate;

a frit seal interposed between the first and second substrates while surrounding the array; and

a film structure comprising one or more layered films, the film structure comprising a portion interposed between the array and the second substrate, the film structure contacting the interior surface and the top surface;

wherein the second substrate comprises a recess on interior surface.

2. The device of claim 1 , wherein the interior surface is substantially planar and has a size substantially equal to or greater than that of the top surface.

3. The device of claim 1 , wherein at least part of the film structure is formed within the recess.

4. The device of claim 1 , wherein the film structure extends into the recess.

5. The device of claim 1 , wherein the film structure further comprises another portion interposed between the first and second substrates while not interposed between the array and the second substrate.

6. The device of claim 1 , wherein the film structure covers substantially the entire portion of the top surface.

7. The device of claim 1 , wherein the film structure comprises a resin.

8. The device of claim 7 , wherein the resin is of a UV curable type or a heat curable type.

9. The device of claim 7 , wherein the resin comprises at least one selected from the group consisting of acrylic resins and polyimide resins.

10. The device of claim 9 , wherein the resin comprises a urethane acrylic resin.

11. The device of claim 1 , wherein at least part of the film structure is substantially transparent with respect to visible light.

12. The device of claim 1 , wherein the array emits visible light through the second substrate.

13. The device of claim 1 , wherein the recess extends along a segment of the frit seal.

14. The device of claim 13 , wherein the recess is substantially parallel to the segment of the frit seal.

15. The device of claim 1 , wherein the recess forms a closed loop.

16. The device of claim 1 , wherein the interior surface is substantially planar, and the recess comprises a slope with reference to the interior surface such that the recess becomes deeper in a direction from the center of the interior surface toward periphery of the interior surface.

17. The device of claim 1 , wherein the interior surface is substantially planar, and the recess comprises a first slope and a second slope with reference to the interior surface, which forms a valley, wherein the first slope is closer to the center than the second slope, wherein the second slope is steeper than the first slope with reference to the interior surface.

18. The device of claim 17 , wherein the second slope is substantially perpendicular to the interior surface.

19. The device of claim 1 , wherein the array comprises a first electrode, a second electrode and an organic light emitting material interposed between the first and second electrodes, wherein the first electrode has a first distance from the first substrate, and the second electrode has a second distance from the first substrate, wherein the second distance is greater than the first distance, and wherein the top surface is a surface of the first electrode.

20. The device of claim 1 , wherein the film structure comprises an organic layer and a protective layer interposed between the array and the organic resin layer, wherein the layer is configured to substantially inhibit the organic resin layer from diffusing into the array.

21. The device of claim 1 , wherein the recess has a depth measured from the interior surface, and wherein the depth is from about 20 μm to about 300 μm.

22. The device of claim 1 , wherein the recess has a width measured on the interior surface in a direction parallel to an edge of the interior surface, and wherein the width is from about 0.1 mm to about 5 mm.

23. The device of claim 1 , wherein the fit seal comprises one or more materials selected from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li 2 O), sodium oxide (Na 2 O), potassium oxide (K 2 O), boron oxide (B 2 O 3 ), vanadium oxide (V 2 O 5 ), zinc oxide (ZnO), tellurium oxide (TeO 2 ), aluminum oxide (Al 2 O 3 ), silicon dioxide (SiO 2 ), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P 2 O 5 ), ruthenium oxide (Ru 2 O), rubidium oxide (Rb 2 O), rhodium oxide (Rh 2 O), ferrite oxide (Fe 2 O 3 ), copper oxide (CuO), titanium oxide (TiO 2 ), tungsten oxide (WO 3 ), bismuth oxide (Bi 2 O 3 ), antimony oxide (Sb 2 O 3 ), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate.

24. A method of making an organic light emitting device according to claim 1 , the method comprising:

providing the first substrate and the array of light emitting pixels formed on the first substrate with or without a layer therebetween;

providing the second substrate and a curable resin formed over a surface of the second substrate;

arranging the first and second substrates such that the resin is located between the array and the second substrate;

interconnecting the first and second substrates with the frit seal such that the frit seal surrounds the array; and

curing the curable resin to form the film structure such that the film structure comprises one or more layered films comprising the cured resin and contacts the second substrate and the array.

25. The method of claim 24 , wherein at least part of the resin flows into the recess.

26. The method of claim 25 , wherein the at least part of the resin stops to flow within the recess.