IP Library Granted Patent US 8,128,449
Granted Patent B2
US 8,128,449 · App. 11/529,913 · Granted Mar 6, 2012

Method of making electronic device with frit seal and frit sealing apparatus

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Quick Facts
Patent No.
US 8,128,449
App. No.
11/529,913
Granted
Mar 6, 2012
Kind
B2
Abstract

Disclosed is a frit sealing apparatus and method of using the same, the apparatus being capable of irradiating infrared rays only to a frit portion of a substrate. The apparatus includes a first chamber, a second chamber positioned inside the first chamber, a lamp positioned inside the second chamber, a stage positioned outside the first chamber to receive and fix a first mother substrate and a second mother substrate, an emitting part formed in the first chamber and the second chamber and positioned to direct heat supplied by the lamp to the stage. The apparatus also includes a mask positioned over the substrates, the mask including one or more transmitting portions positioned over regions containing the frit, and one or more interrupting portions positioned at other regions.

Claims (15)

1. A frit sealing apparatus, comprising:

a platform comprising a receiving surface configured to receive an unfinished electronic device;

a radiation source configured and arranged to radiate a ray toward the platform; and

a mask located between the radiation source and the platform and directly or indirectly stably fixed to the platform, the mask comprising one or more masking portions configured to substantially block the ray from reaching the platform, the mask further comprising one or more transmitting portions configured to substantially allow the ray to reach the platform;

wherein the platform and the radiation source are configured to slide relative to each other; and

wherein the radiation source comprises:

a chamber comprising a wall enclosing a chamber;

a lamp positioned in the chamber; and

a slit formed in the chamber, the slit configured to emit radiation from the lamp outside the chamber and directed to the platform.

2. The apparatus of claim 1 , wherein the radiation source comprises an infrared emitting device.

3. The apparatus of claim 1 , wherein the radiation source further comprising a coolant contacting the wall of the chamber.

4. The apparatus of claim 1 , further comprising the unfinished electronic device comprising a first substrate, a second substrate, an array of organic light emitting pixels and a frit, the array interposed between the first and second substrates, the frit interposed between and contacting the first and second substrates while surrounding the array.

5. The apparatus of claim 4 , wherein the transmitting portions substantially allow the ray to radiate at least a portion of the frit of the unfinished electronic device, and the masking portions substantially block the ray from radiating at least a portion of the array.

6. The apparatus of claim 4 , wherein the unfinished electronic device further comprises one or more additional arrays of organic light emitting pixels interposed between the first and second substrates, and one or more additional fits interposed between and contacting the first and second substrates, and wherein one of the one or more additional fits surrounds one of the one or more additional arrays.

7. The apparatus of claim 1 , further comprising a mechanism configured to slide the platform relative to the radiation source.

Assignments (1)
MERGER Recorded Aug 31, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028921/0334 →