IP Library Patent Application 11531840
Patent Application
App. No. 11/531,840

Integrated Stacked Capacitor and Method of Fabricating Same

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Quick Facts
Patent No.
US None
App. No.
11/531,840
Abstract

An integrated stacked capacitor comprises a first capacitor film ( 46 ) of polycrystalline silicide (poly), a second capacitor film ( 48 ) and a first dielectric ( 26 ) sandwiched between the first capacitor film ( 46 ) and second capacitor film ( 48 ). A second dielectric ( 34 ) and a third capacitor film ( 50 ) are provided. The second dielectric ( 34 ) is sandwiched between the second capacitor film ( 48 ) and third capacitor film ( 50 ). A method for fabrication of an integrated stacked capacitor comprises the following sequence of steps: applying a polysilicide layer ( 20 ) to form the first capacitor film ( 46 ); applying a first dielectric ( 26 ); applying a first metallization layer ( 28 ) to form the second capacitor film ( 48 ); applying a second dielectric ( 34 ); and applying a second metallization layer ( 34 ) to form the third capacitor film ( 50 ).

Claims (7)

1 - 14 . (canceled)

15 . An integrated stacked capacitor comprising:

a first capacitor film of polycrystalline silicide (poly);

a second capacitor film comprising a titanium-alloy;

a first dielectric sandwiched between said first capacitor film and said second capacitor film;

a second dielectric; and

a third capacitor film, wherein said second dielectric is sandwiched between said second capacitor film and said third capacitor film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2021
From: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 055314/0255 →