Micro-fluid ejection heads with chips in pockets
View Patent ↗Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.
1. A micro-fluid ejection head comprising:
a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto and on a same side of the substrate as the device surface, the substrate having a fluid supply surface opposite the device surface;
a chip associated with the plurality of fluid ejection actuator devices, the chip being attached in the pocket adjacent to the device surface of the substrate, the device surface and the chip in the pocket being substantially planarized;
a conductive material adjacent to the device surface and in electrical communication with the driver chip to provide electrical connections in a planarized layer between the chip and the fluid ejection actuator devices on said same side of the substrate; and
a conductive plug port through the substrate underneath the pocket, the port being filled with a conductive plug to electrically communicate the chip through the substrate to the fluid supply surface.
2. The micro-fluid ejection head of claim 1 , further comprising a nozzle plate adjacent to the device surface of the substrate.
3. The micro-fluid ejection head of claim 1 , wherein the substrate further includes a fluid supply slot therein and adjacent to the plurality of fluid ejection actuators for flow of fluid from a fluid supply surface to the fluid ejection actuator devices.
4. The micro-fluid ejection head of claim 1 , wherein the substrate comprises a material selected from the group consisting of glass, ceramic, metal, and plastic.
5. The micro-fluid ejection head of claim 1 , wherein the substrate comprises a large array substrate having a length greater than about 2.5 centimeters.
6. The micro-fluid ejection head of claim 1 , wherein the chip is attached to the substrate using a conductive adhesive.
7. The micro-fluid ejection head of claim 1 , further comprising at least one port in the pocket for filling a gap between the chip and the device surface of the substrate with an adhesive filler from the fluid supply surface of the substrate.
8. The micro-fluid ejection head of claim 1 , further comprising a conductor support film adjacent to the device surface of the substrate for spanning a gap in the pocket between the chip and the device surface of the substrate.
9. The micro-fluid ejection head of claim 8 , further comprising a conductor adjacent to the conductor support film and in electrical communication with the conductive material and the chip.
10. The micro-fluid ejection head of claim 1 , further comprising a diode array adjacent to the substrate for reducing a number of output signal lines from the chip to the plurality of fluid ejection actuator devices.
11. The micro-fluid ejection head of claim 1 , further comprising a plurality of chips associated with the plurality of fluid ejection actuator devices.