IP Library Granted Patent US 7,756,687
Granted Patent B2
US 7,756,687 · App. 11/536,740 · Granted Jul 13, 2010

Method for predicting contributions of silicon interstitials to n-type dopant transient enhanced diffusion during a pn junction formation

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Quick Facts
Patent No.
US 7,756,687
App. No.
11/536,740
Granted
Jul 13, 2010
Kind
B2
Abstract

A method for predicting the contribution of silicon interstitials to n-type dopant transient enhanced diffusion during a pn junction formation is disclosed. Initially, fundamental data for a set of microscopic processes that can occur during one or more material processing operations are obtained. The fundamental data are then utilized to build kinetic models for a set of reactions that contribute substantially to an evolution of n-type dopant concentration and electrical activities. The kinetic models are subsequently applied to a simulator to predict temporal and spatial evolutions of concentration and electrical activity profiles of the n-type dopants.

Claims (36)

1. A computer-implemented method for predicting a dopant concentration profile of a silicon substrate during one or more material processing operations on the silicon substrate, the method comprising:

receiving, by a computing device, fundamental data representative of atomic processes that can occur in the silicon substrate during the one or more material processing operations;

generating from the fundamental data, by the computing device, a kinetic model representative of reactions that contribute to an evolution of dopant concentration for the silicon substrate, said generating including estimating a rate of vacancy annihilation of arsenic-vacancy complexes and vacancy clusters through interstitial-vacancy recombination in the silicon substrate; and

generating from the kinetic model, by the computing device, data representative of a profile for the evolution of the dopant concentration in the silicon substrate.

2. The method of claim 1 , wherein said generating a kinetic model includes estimating a rate of formation of arsenic-interstitial pairs by a combination of silicon interstitials and substitutional arsenic atoms.

3. The method of claim 2 , wherein the rate of formation is estimated by determining at least one of an energy barrier or an energy gain of the formation.

4. The method of claim 1 , wherein said generating a kinetic model includes estimating a rate of formation of arsenic-interstitial clusters by a combination of mobile silicon interstitials, arsenic-interstitial pairs, and immobile arsenic-interstitial clusters by calculating thermodynamics of arsenic-interstitial combination reactions by

As m I n +I→As m I n+1 or

As m I n +AsI→As m+1 I n+1

where As represents arsenic, I represents a silicon interstitial, m is a number of substitutional arsenic atoms, and n is a number of silicon interstitials.

5. The method of claim 1 , wherein said estimating a rate of vacancy annihilation of arsenic-vacancy complexes and vacancy clusters through interstitial-vacancy recombination includes determining thermodynamics of interstitial-vacancy recombination reactions by:

As m V n+I→As m V n−1

where As represents arsenic, I represents a silicon interstitial, m is a number of substitutional arsenic atoms, and n is a number of vacancies.

6. The method of claim 1 , further comprising displaying, on a monitor, the data representative of a profile for the evolution of the dopant concentration in the silicon substrate.

7. A tangible computer-readable medium having instructions stored thereon to enable a computing device to perform a method to predict a dopant concentration profile of dopants in a silicon substrate during one or more material processing operation on the silicon substrate, the method comprising:

receiving fundamental data representative of atomic processes that can occur in the silicon substrate during the one or more material processing operations;

generating from the fundamental data, a kinetic model representative of reactions that contribute to an evolution of dopant concentration of the silicon substrate, said generating including estimating a rate of vacancy annihilation of arsenic-vacancy complexes and vacancy clusters through interstitial-vacancy recombination in the silicon substrate; and

generating from the kinetic model, data representative of a profile of the evolution of the dopant concentration in the silicon substrate.

8. The computer-readable medium of claim 7 , wherein said generating a kinetic model comprises estimating a rate of formation of arsenic-interstitial pairs by a combination of silicon interstitials and substitutional arsenic by determining at least one of an energy barrier or an energy gain of the formation.

9. The computer-readable medium of claim 8 , wherein the energy gain from the formation of arsenic-interstitials pairs has a value between 0.15 and (0.66+E g −E D ) eV, where E g is a band gap value of silicon, and E D is an arsenic-interstitial donor level of silicon.

10. The computer-readable medium of claim 7 , wherein said generating a kinetic model comprises estimating a rate of formation of arsenic-interstitial clusters by a combination of mobile silicon interstitials, arsenic-interstitial pairs, and immobile arsenic-interstitial clusters by calculating thermodynamics of arsenic-interstitial combination reactions by

As m I n +I→As m I n+1 or

As m I n +AsI→As m+1 I n+1

where As represents arsenic, I represents a silicon interstitial, m is a number of substitutional arsenic atoms, and n is a number of silicon interstitials.

11. The computer-readable medium of claim 7 , wherein said estimating a rate of vacancy annihilation of arsenic-vacancy complexes and vacancy clusters through interstitial-vacancy recombination comprises determining thermodynamics of interstitial-vacancy recombination reactions:

As m V n +I→As m V n−1

where As represents arsenic, I represents a silicon interstitial, m is a number of substitutional arsenic atoms, and n is a number of vacancies.

12. A system for predicting a dopant concentration profile of a silicon substrate during one or more material processing operations on the silicon substrate, the system comprising:

a processor; and

a computer-readable medium coupled to the one or more processors and having stored thereon, computer-executable instructions that, if executed by the one or more processors, cause the one or more processors to perform a method comprising:

receiving fundamental data representative of atomic processes that can occur in the silicon substrate during the one or more material processing operations;

generating, from the fundamental data, a kinetic model representative of reactions that contribute to an evolution of dopant concentration for the silicon substrate, said generating including estimating a rate of vacancy annihilation of arsenic-vacancy complexes and vacancy clusters through interstitial-vacancy recombination in the silicon substrate; and

generating, from the kinetic model, data representative of a profile for the evolution of the dopant concentration in the silicon substrate.

13. The system of claim 12 , wherein said generating a kinetic model includes estimating a rate of formation of arsenic-interstitial pairs by a combination of silicon interstitials and substitutional arsenic atoms.

14. The system of claim 12 , wherein said generating a kinetic model includes estimating a rate of formation of arsenic-interstitial clusters by a combination of mobile silicon interstitials, arsenic-interstitial pairs, and immobile arsenic-interstitial clusters.

15. The system of claim 12 , wherein said generating a kinetic model includes estimating a rate of vacancy annihilation of arsenic-vacancy complexes and vacancy clusters through interstitial-vacancy recombination.