IP Library Granted Patent US 7,710,199
Granted Patent B2
US 7,710,199 · App. 11/536,820 · Granted May 4, 2010

Method and apparatus for stabilizing RF power amplifiers

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Quick Facts
Patent No.
US 7,710,199
App. No.
11/536,820
Granted
May 4, 2010
Kind
B2
Abstract

A method and apparatus is provided for use in power amplifiers for reducing the peak voltage that transistors are subjected to. A power amplifier is provided with first and second switching devices and an inductor connected between the switching devices. The switching devices are driven such that the switching devices are turned on and off during the same time intervals. Differential RF power amplifiers are also provided with inductive networks coupled at various nodes of the power amplifiers. In some examples, techniques are used to stabilize differential power amplifiers by stabilizing common-mode feedback loops.

Claims (35)

1. A differential RF power amplifier comprising:

a first amplifier;

a second amplifier, wherein the first and second amplifiers are configured to be coupled differentially to a load;

one or more tank circuits coupled to the first and second amplifiers; and

first and second cross-coupled switching devices coupled to the first and second amplifiers, wherein the first and second cross-coupled switching devices are configured to provide attenuation to signals in a common-mode path while providing less attenuation to signals in a differential-mode path.

2. A method of stabilizing a differential RF power amplifier comprising:

providing a first amplifier;

providing a second amplifier;

coupling the first and second amplifiers differentially to a load;

providing a plurality of circuit elements coupled to the first and second amplifiers, wherein the plurality of circuit elements form one or more tank circuits; and

coupling first and second cross-coupled switching devices to the first and second amplifiers, wherein the first and second cross-coupled switching devices are configured to provide attenuation to signals in a common-mode path while providing less attenuation to signals in a differential-mode path.

3. The differential RF power amplifier of claim 1 , wherein the first and second switching devices are coupled to inputs of the first and second amplifiers.

4. The differential RF power amplifier of claim 1 , wherein the first and second switching devices are coupled to outputs of the first and second amplifiers.

5. The differential RF power amplifier of claim 1 , wherein the first and second switching devices are sized to optimize the attenuation of signals in the common-mode path and differential-mode path.

6. The differential RF power amplifier of claim 1 , wherein the drain of the first switching device and the gate of the second switching device are coupled to the first amplifier and the drain of the second switching device and the gate of the first switching device are coupled to the second amplifier.

7. The differential RF power amplifier of claim 1 , wherein:

the first amplifier is comprised of third and fourth switching devices coupled between a voltage differential, and a first inductance coupled between the third and fourth switching devices; and

the second amplifier is comprised of fifth and sixth switching devices coupled between a voltage differential, and a second inductance coupled between the fifth and sixth switching devices.

8. The differential RF power amplifier of claim 1 , wherein the first and second amplifiers are implemented using a complementary metal oxide semiconductor (CMOS).

9. The differential RF power amplifier of claim 1 , wherein the differential RF power amplifier is suitable for use in a cellular telephone.

10. The method of claim 2 , wherein the first and second switching devices are coupled to inputs of the first and second amplifiers.

11. The method of claim 2 , wherein the first and second switching devices are coupled to outputs of the first and second amplifiers.

12. The method of claim 2 , wherein the first and second switching devices are sized to optimize the attenuation of signals in the common-mode path and differential-mode path.

13. The method of claim 2 , wherein the drain of the first switching device and the gate of the second switching device are coupled to the first amplifier and the drain of the second switching device and the gate of the first switching device are coupled to the second amplifier.

14. The method of claim 2 , the method further comprising:

coupling a drain of the first switching device and a gate of the second switching device to the first amplifier; and

coupling a drain of the second switching device and a gate of the first switching device to the second amplifier.

15. The method of claim 14 , further comprising coupling a resistor between the gates of the first and second switching devices.

16. The method of claim 2 , further comprising:

providing the first amplifier by coupling third and fourth switching devices between a voltage differential, and coupling a first inductance between the third and fourth switching devices; and

providing the second amplifier by coupling fifth and sixth switching devices between a voltage differential, and coupling a second inductance between the fifth and sixth switching devices.

17. The method of claim 2 , wherein the first and second amplifiers are implemented using a complementary metal oxide semiconductor (CMOS).

18. The method of claim 2 , wherein the differential RF power amplifier is suitable for use in a cellular telephone.

19. The differential RF power amplifier of claim 1 , wherein the common-mode path is formed when one or more of the tank circuits resonates.

20. The method of claim 2 , wherein the common-mode path is formed when one or more of the tank circuits resonates.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2014
From: BLACK SAND TECHNOLOGIES, INC.
To: QUALCOMM INCORPORATED
Reel/Frame 034077/0072 →
RELEASE OF SECURITY INTEREST Recorded Sep 12, 2014
From: SILICON LABORATORIES INC.
To: BLACK SAND TECHNOLOGIES INC.
Reel/Frame 033729/0183 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2014
From: SILICON LABORATORIES INC.
To: BLACK SAND TECHNOLOGIES, INC.
Reel/Frame 033500/0122 →
RELEASE OF SECURITY INTEREST Recorded Jun 30, 2014
From: COMERICA BANK
To: BLACK SAND TECHNOLOGIES, INC.
Reel/Frame 033258/0225 →
MERGER Recorded Jun 27, 2014
From: WAVEFORM ACQUISITION CORPORATION
To: BLACK SAND TECHNOLOGIES, INC.
Reel/Frame 033247/0787 →
SECURITY AGREEMENT Recorded Mar 5, 2009
From: BLACK SAND TECHNOLOGIES, INC.
To: COMERICA BANK
Reel/Frame 022343/0475 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2008
From: SILICON LABORATORIES INC.
To: BLACK SAND TECHNOLOGIES, INC.
Reel/Frame 021243/0389 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2008
From: BOCOCK, RYAN M; BOCKELMAN, DAVID; PAUL, SUSANNE A; DUPUIS, TIMOTHY J
To: SILICON LABORATORIES INC.
Reel/Frame 020856/0141 →