ENCAPSULATED TRANSPONDER AND METHOD FOR MANUFACTURING THE SAME
The invention concerns an encapsulated transponder ( 1 ) having an integrated circuit ( 2 ), an antenna ( 3 ) and one or more electrical connections ( 4 ) between the integrated circuit ( 2 ) and the antenna ( 3 ). At least a part of the transponder ( 1 ) comprising the electrical connections ( 4 ) is embedded within a capsule ( 6 ) that is removable without damaging the electrical connections ( 4 ). Also claimed is a method for the production of such a transponder ( 1 ).
1 . A transponder, comprising:
an integrated circuit;
an antenna; and
one or more electrical connections between the integrated circuit and the antenna, wherein at least a part of the transponder comprising the electrical connections is embedded within a capsule that supports and secures the electrical connections, the capsule being removable from the transponder without damaging the electrical connections.
2 . The transponder according to claim 1 , wherein at least a part of the integrated circuit and a part of the antenna are embedded in the capsule in such way that the capsule holds the integrated circuit and the antenna in a specific relative position.
3 . The transponder according to claim 1 , wherein the antenna is directly connected onto the integrated circuit.
4 . The transponder according to claim 1 , wherein the antenna comprises a conductive wire.
5 . The transponder according to claim 1 , wherein the capsule is malleable.
6 . The transponder according to claim 1 , wherein the capsule comprises at least one of wax and paraffin.
7 . The transponder according to claim 5 , wherein the malleable nature of the capsule permits the position of the integrated circuit to be changed relative to the antenna without damaging the electrical connections between the integrated circuit and antenna.
8 . The transponder according to claim 1 , wherein the capsule is removable by application of heat to the capsule and wherein the capsule temperature does not exceed approximately 110° C.
9 . A method for producing a transponder having an integrated circuit, an antenna, and one or more electrical connections between the integrated circuit and the antenna, comprising:
a) at a first location, submerging at least a part of the transponder comprising the electrical connections in a coating liquid resulting in a capsule that covers the electrical connections and supports and secures the electrical connections;
b) transporting the transponder to a second location;
c) removing the capsule from the transponder at the second location without damaging the electrical connections.
10 . The method according to claim 9 , further comprising:
before the submerging step, pre-heating the transponder to a temperature higher than the fusion temperature of coating liquid.
11 . The method according to claim 10 , wherein said fusion temperature of said coating liquid is between about 86° C. and about 110° C.
12 . The method according to claim 9 , further comprising:
after the submerging step, exposing a part of the coating liquid embedding the transponder to a flux of air to solidify at least a part of the coating liquid.
13 . The method according to claim 9 , further comprising:
controlling Radio Frequency Identification (RFID) functionalities of the transponder with an RFID reader during the submerging step,
14 . The method according to claim 9 , wherein the coating liquid comprises at least one of melted wax and paraffin.
15 . The method according to claim 9 , further comprising adding final packaging to the transponder after the capsule is removed from the transponder.
16 . The method according to claim 9 , further comprising adding final packaging to the transponder before the capsule is removed from the transponder.
17 . The method according to claim 9 , further comprising further processing the transponder following removal of the capsule.
18 . The method according to claim 9 , wherein removing the capsule from the transponder comprises heating the capsule to no more than approximately 110° C.