Shaped lead assembly for optoelectronic devices
View Patent ↗An optoelectronic package is attached to a printed circuit board, in which optoelectronic package has a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.
1. A method for attaching an optoelectronic package to a printed circuit board, the method comprising:
shaping a plurality of leads that extend from the package such that each lead includes a first portion extending from the package surface, an end portion oriented for insertion into a corresponding via defined in a printed circuit board, and a shaped portion interposed between the first portion and the end portion, the shaped portion including at least one bend defined in a first plane;
receiving at least part of the shaped portion of each lead into a clip assembly that maintains the orientation of the end portion of each lead; and
inserting the end portion of each lead into a corresponding through-hole via defined in a first surface of the printed circuit board.
2. The method for attaching as defined in claim 1 , further comprising soldering each lead inserted into the corresponding through-hole via such that a segment of the end portion extends beyond a second surface of the printed circuit board.
3. The method for attaching as defined in claim 1 , wherein shaping the plurality is performed manually.
4. The method for attaching as defined in claim 1 , wherein receiving at least part of the shaped portion further comprises:
receiving at least part of the shaped portion of each lead into a base of the clip assembly; and
attaching a cap on the base to cover a portion of each lead.
5. The method for attaching as defined in claim 1 , wherein receiving at least part of the shaped portion further comprises receiving at least part of the shaped portion of each lead into the clip assembly such that the leads are electrically isolated from one another.