Shaped lead assembly for optoelectronic devices
View Patent ↗An optical subassembly is used in connection with an optoelectronic package with a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.
1. An optical subassembly, comprising:
a header containing at least one optoelectronic component;
a plurality of conductive leads that are in operable communication with the at least one optoelectronic component, each lead including:
a straight portion extending from a surface of the header;
an end portion oriented so as to be received by a through-hole via defined in a printed circuit board; and
a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane; and
a clip assembly having a plurality of cavities that each receive a corresponding one of the leads such that the end portion of each lead extends from a surface of the clip.
2. The optical subassembly as defined in claim 1 , wherein the clip assembly maintains the orientation of the end portion of each lead in engaging a corresponding via defined in a printed circuit board.
3. The optical subassembly as defined in claim 2 , wherein the clip assembly is formed from a material that assists in controlling impedances of the leads.
4. The optical subassembly as defined in claim 3 , wherein the clip assembly further comprises:
a base portion including the plurality of cavities; and
a cap that removably attaches to the base portion.
5. The optical subassembly as defined in claim 4 , wherein the cap includes a tongue that covers a portion of at least some of the leads, and wherein the base portion includes at least one post that cooperates with at least one recess defined in the cap.
6. The optical subassembly as defined in claim 5 , wherein the base portion of the clip assembly includes extended portions that provide spacing between the base portion and a surface of the printed circuit board proximate the vias.
7. The optical subassembly as defined in claim 6 , wherein the cavities include beveled surfaces to assist in receiving the leads.
8. The optical subassembly as defined in claim 7 , wherein the leads are received by vias that are defined on a single surface of the printed circuit board.
9. The optical subassembly as defined in claim 1 , wherein the optical subassembly is adapted for use in an optical transceiver module that includes:
a housing; and
said printed circuit board at least partially received by the housing.
10. The optical subassembly as defined in claim 1 , wherein the plurality of conductive leads consists of five leads.
11. The optical subassembly as defined in claim 1 , wherein the plurality of conductive leads consists of four leads.
12. The optical subassembly as defined in claim 1 , wherein the optoelectronic component comprises an optical transmitter component.
13. The optical subassembly as defined in claim 1 , wherein the optoelectronic component comprises an optical receiver component.
14. The optical transceiver module as defined in claim 1 , wherein the shaped portion of each lead provides stress relief for retaining the end portion of the lead within the via.
15. The optical transceiver module as defined in claim 1 , wherein the end portion of each lead is substantially orthogonal to the straight portion of the lead.