LED assembly with vented circuit board
View Patent ↗A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.
1. A circuit board LED display, comprising:
a substrate comprising a first electrical layer and a second electrical layer electrically insulated from the first electrical layer, wherein the substrate is formed in a grid pattern having junctions at the intersection of bridges defining air vents through which air can freely pass through the substrate, wherein the substrate comprises a thermally conductive and electrically resistive layer to which the plurality of LEDs are attached, wherein the first electrically conductive layer is formed below the thermally conductive and electrically resistive layer; and
a plurality of LEDs arranged at the junctions and electrically connected to the first electrical layer and the second electrical layer.