IP Library Granted Patent US 8,728,660
Granted Patent B2
US 8,728,660 · App. 11/539,720 · Granted May 20, 2014

Anode having an anode lead bonded to an active material layer, method of manufacturing of the anode, and battery including the anode

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Quick Facts
Patent No.
US 8,728,660
App. No.
11/539,720
Granted
May 20, 2014
Kind
B2
Abstract

An anode which can improve contact characteristics between an active material layer and anode lead and can prevent electrical resistance from increasing, a method of manufacturing the anode, and a battery including the anode are provided. An active material layer containing silicon as an element is provided on a current collector. An anode lead is bonded to the active material layer. At least part of a bond region between the anode lead and the active material layer is made of copper or an alloy containing copper. Thereby, the electrical resistance can be prevented from being increased even though the anode lead is bonded to the active material layer. The anode lead may be made of copper or an alloy containing copper. Otherwise, coating layer made of copper or an alloy containing copper may be provided on the surface of a base.

Claims (52)

1. An anode comprising:

a current collector;

an active material layer containing silicon on the current collector; and

an anode lead,

wherein,

a bond material made of copper or an alloy containing copper bonds the anode lead to at least a portion of the active material layer, and

the anode lead has an adhesive film thereon.

2. The anode according to claim 1 , wherein the anode lead includes the bond material in at least a portion of the anode lead.

3. The anode according to claim 1 , wherein the anode lead has a base and a coating layer that is provided on at least a part of the base, the coating layer being made of the bond material.

4. The anode according to claim 3 , wherein the base is made of nickel, an alloy containing nickel, iron, or an alloy containing iron.

5. The anode according to claim 1 , wherein the anode lead is alloyed with the active material layer in at least a part of an interface between the anode lead and the active material layer.

6. The anode according to claim 1 , wherein the active material layer is formed by vapor-phase deposition method.

7. The anode according to claim 1 , wherein the active material layer is alloyed with the current collector in at least a part of an interface between the active material layer and the current collector.

8. An anode comprising:

a current collector;

an active material layer containing silicon on the current collector;

an anode lead; and

a bond made of copper or an alloy containing copper that bonds the anode lead to at least a portion of the active material layer,

wherein,

the bond and the active material layer are alloyed together, and

the anode lead has an adhesive film thereon.

9. The anode according to claim 8 , wherein the active material layer is formed by vapor-phase deposition method.

10. The anode according to claim 8 , wherein the active material layer is alloyed with the current collector in at least a part of an interface between the active material layer and the current collector.

11. The anode according to claim 8 , wherein the anode lead is made of nickel, an alloy containing nickel, iron, or an alloy containing iron.

12. A method of manufacturing an anode, comprising the steps of:

providing an active material layer containing silicon on a current collector; and

bonding an anode lead to at least a portion of the active material layer by means of a bond material made of copper or an alloy containing copper,

wherein,

the anode lead has an adhesive film thereon.

13. The method of manufacturing an anode according to claim 12 , wherein the anode lead is bonded to the active material layer by resistance welding.

14. A method of manufacturing an anode, comprising the steps of:

providing an active material layer containing silicon on a current collector;

bonding an anode lead to at least a portion of the active material layer with a bond made of copper or an alloy containing copper,

wherein,

the bond and the active material layer are alloyed together, and

the anode lead has an adhesive film thereon.

15. A battery comprising:

a cathode;

an anode including (i) an active material layer containing silicon on a current collector and (ii) an anode lead; and

an electrolyte,

wherein,

a bond material made of copper or an alloy containing copper bonds the anode lead to at least a portion of the active material layer, and

an adhesive film is on the anode lead.

16. The battery according to claim 15 , wherein the anode lead includes the bond material in at least a portion of the anode lead.

17. The battery according to claim 15 , wherein the anode lead has a base and a coating layer that is provided on at least a part of the base, the coating layer being made of the bond material.

18. A battery comprising:

a cathode;

an anode including (i) an active material layer containing silicon on a current collector, (ii) an anode lead, and (iii) a bond made of copper or an alloy containing copper that bonds the anode lead to at least a portion of the active material layer; and

an electrolyte,

wherein,

the bond and the active material layer are alloyed together, and

an adhesive film is on the anode lead.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2018
From: TOHOKU MURATA MANUFACTURING CO., LTD
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 045103/0835 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2018
From: SONY CORPORATION
To: TOHOKU MURATA MANUFACTURING CO.,LTD
Reel/Frame 045104/0001 →