Granted Patent B2

US 7,441,222 · App. 11/540,082 · Granted Oct 21, 2008

Abstract

Claims (51)

1. A differential pair connection arrangement comprising:

first and second signal traces formed in first and second layers of a substrate, respectively, the first and second signal traces each comprising run portions and end portions, the end portions of the first and second signal traces each splitting into two branches on a first lateral side of a first pad, a branch of each signal trace traversing a path around a top side of the first pad and a branch of each signal trace traversing a path around a bottom side of the first pad, the branches of the first and second signal traces coming together again in terminal portions on a second lateral side of the first pad, the terminal portion of the first signal trace extending toward and contacting the first pad and the terminal portion of the second signal trace extending away from the first pad and contacting a second pad, and

wherein a projection of the run portion and branches of the second signal trace in a plane of the first layer substantially overlaps the run portion and branches of the first signal trace up to the portions where the branches of the traces come together again to form the terminal portions of the signal traces.

2. The differential pair connection arrangement of claim 1 , where a width of the branches of the first and second signal traces is w, and the width of the run portions of the first and second signal traces is 2w.

3. The differential pair connection arrangement of claim 1 where the terminal portions of the first and second traces are substantially the same length.

4. The differential pair connection arrangement of claim 1 where the end portions of the first and second signal traces comprise first end portions positioned at proximal ends of the run portions of the first and second signal traces, the first and second signal traces further comprising second end portions positioned at distal ends of the run portions of the first and second signal traces, the second end portions of the first and second signal traces splitting into two branches on a first lateral side of a third pad, a branch of each signal trace traversing a path around a top side of the third pad and a branch of each signal trace traversing a path around a bottom side of the third pad, the branches of the second end portions coming together again in terminal portions on a second lateral side of the third pad, the terminal portion of the second end portion of the first signal trace extending toward and contacting the third pad, and the terminal portion of the second end portion of the second signal trace extending in a direction away from the third pad and contacting a fourth pad, wherein a projection of the branches of the second end portion of the second signal trace in a plane of the first layer overlap the branches of the second end portion of the first signal trace.

5. The differential pair connection arrangement of claim 1 where the substrate comprises a printed circuit board.

6. The differential pair connection arrangement of claim 1 where the substrate comprises an integrated circuit.

7. The differential pair connection arrangement of claim 1 where the first and second signal traces comprise conductive material.

8. The differential pair connection arrangement of claim 1 where the first and second signal traces carry a 10 GbE differential signal.

9. The differential pair connection arrangement of claim 1 where the first and second signal traces are used to make interconnections in a PCI Express bus circuit.

10. The differential pair connection arrangement of claim 1 where the first and second signal traces are used to make interconnections in a Serial ATA bus circuit.

11. The differential pair connection arrangement of claim 1 where the first and second signal traces are used to make interconnections in a Serial Attached SCSI bus circuit.

12. The differential pair connection arrangement of claim 1 where the first and second signal traces carry a T1 differential signal.

13. The differential pair connection arrangement of claim 1 where the first and second signal traces carry an E1 differential signal.

14. The differential pair connection arrangement of claim 1 where the first and second signal traces are used to make interconnections between a front side bus and a fully buffered DIMM.

15. The differential pair connection arrangement of claim 1 where the first and second signal traces are used to make interconnections in a USB circuit.

16. The differential pair connection arrangement of claim 1 where the first and second signal traces are used to make interconnections in a circuit comprising at least one SerDes integrated circuit.

17. The differential pair connection arrangement of claim 1 where the first and second signal traces are used to make interconnections with at least one integrated circuit implemented in a ball grid array package.

18. The differential pair connection arrangement of claim 1 where the first and second signal traces are used to make interconnections with at least one integrated circuit implemented in a pin grid array package.

19. A printed circuit board comprising:

at least one integrated circuit, the integrated circuit having first and second ports, the first and second ports of the integrated circuit connected to first and second pads, respectively, of the printed circuit board;

a differential pair connection arrangement coupled to the first and second pads, the differential pair connection arrangement comprising:

a first signal trace formed in a first layer of the printed circuit board, the first signal trace comprising a run portion and an end portion, the end portion splitting into two branches on a first lateral side of the first pad in the first layer, the two branches traversing paths around top and bottom sides of the first pad, and coming together again in a terminal portion on a second lateral side of the first pad, the terminal portion contacting the first pad;

a second signal trace formed in a second layer of the printed circuit board, the second signal trace comprising a run portion and an end portion, the end portion splitting into two branches on the first lateral side of the first pad, the two branches of the second trace traversing paths around the top and bottom sides of the first pad, and coming together again in a terminal portion on the second lateral side of the first pad, the terminal portion of the second trace extending in a direction away from the first pad and contacting the second pad;

wherein a projection of the run portion and branches of the second signal trace in a plane of the first layer substantially overlaps the run portion and branches of the first signal trace.

20. The printed circuit board of claim 19 where a width of each of the branches of the first and second signal traces is w and a width of each of the run portions of the first and second signal traces is 2w.

21. The printed circuit board of claim 19 where the end portions of the first and second signal traces comprise first end portions positioned at proximal ends of the run portions of the first and second signal traces, the first and second signal traces further comprising second end portions positioned at distal ends of the run portions of the first and second signal traces, the second end portions of the first and second signal traces splitting into two branches on a first lateral side of a third pad, a branch of each signal trace traversing a path around a top side of the third pad and a branch of each signal trace traversing a path around a bottom side of the third pad, the branches of the second end portions coming together again in terminal portions on a second lateral side of the third pad, the terminal portion of the second end portion of the first signal trace extending toward and contacting the third pad, and the terminal portion of the second portion of the second signal trace extending in a direction away from the third pad and contacting a fourth pad, wherein a projection of the branches of the second end portion of the second signal trace in a plane of the first layer overlap the branches of the second end portion of the first signal trace.

22. The differential pair connection arrangement of claim 19 where the first and second signal traces comprise conductive material.

23. An electronic device comprising:

at least one printed circuit board, the printed circuit board comprising:

at least one integrated circuit, the integrated circuit having first and second ports, the first and second ports of the integrated circuit connected to first and second pads, respectively, of the printed circuit board;

a differential pair connection arrangement coupled to the first and second pads, the differential pair connection arrangement comprising:

first and second signal traces formed in first and second layers of the printed circuit board, respectively, the first and second signal traces each comprising run portions and end portions, the end portions of the first and second signal traces each splitting into two branches on a first lateral side of the first pad, a branch of each signal trace traversing a path around a top side of the first pad and a branch of each signal trace traversing a path around a bottom side of the first pad, the branches of the first and second signal traces coming together again in terminal portions on a second lateral side of the first pad, the terminal portion of the first signal trace extending toward and contacting the first pad and the terminal portion of the second signal trace extending away from the first pad and contacting a second pad, and

wherein a projection of the run portion and branches of the second signal trace in a plane of the first layer substantially overlaps the run portion and branches of the first signal trace up to the portions where the branches of the traces come together again to form the terminal portions of the traces.

24. The electronic device of claim 23 , where a width of each of the branches of the first and second signal traces is w and a width of each of the run portions of the first and second signal traces is 2w.

25. The electronic device of claim 23 where the end portions of the first and second signal traces comprise first end portions positioned at proximal ends of the run portions of the first and second signal traces, the first and second signal traces further comprising second end portions positioned at distal ends of the run portions of the first and second signal traces, the second end portions of the first and second signal traces splitting into two branches on a first lateral side of a third pad, a branch of each signal trace traversing a path around a top side of the third pad and a branch of each signal trace traversing a path around a bottom side of the third pad, the branches of the second end portions coming together again in terminal portions on a second lateral side of the third pad, the terminal portion of the second end portion of the first signal trace extending in a direction toward and contacting the third pad, the terminal portion of the second end portion of the second signal trace extending in a direction away from the third pad and contacting a fourth pad, wherein a projection of the branches of the second end portion of the second signal trace in a plane of the first layer substantially overlap the branches of the second end portion of the first signal trace.

26. The method of claim 23 where the first and second signal traces comprise conductive material.

27. A method comprising:

forming first and second pads in a printed circuit board;

forming a first signal trace in a first layer of the printed circuit board, the first signal trace comprising a run portion and an end portion, the end portion splitting into two branches on a first lateral side of the first pad, one branch traversing a path around a top side of the first pad and one branch traversing a path around a bottom side of the first pad, the two branches coming together again in a terminal portion on a second lateral side of the first pad, the terminal portion extending toward and contacting the first pad;

forming a second signal trace in a second layer of the printed circuit board, the first signal trace comprising a run portion and an end portion, the end portion of the second signal trace splitting into two branches on a first lateral side of the first pad, one branch traversing a path around a top side of the first pad and one branch traversing a path around a bottom side of the first pad, the two branches coming together again in a terminal portion on a second lateral side of the first pad, the terminal portion of the second signal trace extending away from the first pad and contacting a second pad; and

wherein a projection of the run portion and branches of the second signal trace in a plane of the first layer substantially overlaps the run portion and branches of the first signal trace.

28. The method of claim 27 where a width of each of the branches of the first and second signal traces is w and a width of the run portions of each of the first and second signal traces is 2w.

29. The method of claim 27 where the forming first and second pads further comprises forming third and fourth pads, and where end portions of the first and second signal traces comprise first end portions located at proximal ends of the run portions of the first and second signal traces, the first and second signal traces further comprising second end portions located at a distal ends of the run portions of the first and second signal traces, the second end portions of the first and second signal traces splitting into two branches on a first lateral side of the third pad, a branch of each signal trace traversing a path around a top side of the third pad and a branch of each signal trace traversing a path around a bottom side of the third pad, the branches of the second end portions coming together again in terminal portions on a second lateral side of the third pad, the terminal portion of the second end portion of the first signal trace extending in a direction toward and contacting the third pad, and the terminal portion of the second end portion of the second signal trace extending in a direction away from the third pad and contacting a fourth pad, wherein a projection of the branches of the second end portion of the second signal trace in a plane of the first layer overlaps the branches of the second end portion of the first signal trace.

30. The method of claim 27 where the first and second signal traces comprise conductive material.

31. A computer readable memory medium tangibly embodying a computer program, wherein when the computer program is executed by a digital processing apparatus operations are performed, the operations comprising:

forming a first and second pads in a printed circuit board;

forming a first signal trace in a first layer of the printed circuit board, the first signal trace comprising a run portion and an end portion, the end portion splitting into two branches on a first lateral side of the first pad, one branch traversing a path around a top side of the first pad and one branch traversing a path around a bottom side of the first pad, the two branches coming together again in a terminal portion on a second lateral side of the first pad, the terminal portion extending toward and contacting the first pad;

forming a second signal trace in a second layer of the printed circuit board, the first signal trace comprising a run portion and an end portion, the end portion of the second signal trace splitting into two branches on a first lateral side of the first pad, one branch traversing a path around a top side of the first pad and one branch traversing a path around a bottom side of the first pad, the two branches coming together again in a terminal portion on a second lateral side of the first pad, the terminal portion of the second signal trace extending away from the first pad and contacting a second pad; and

wherein a projection of the run portion and branches of the second signal trace in a plane of the first layer substantially overlaps the run portion and branches of the first signal trace.

Assignments (12)