Micro-electromechanical nozzle assembly with an arcuate actuator
View Patent ↗A micro-electromechanical nozzle assembly includes a substrate that defines an ink chamber and an ink ejection port in fluid communication with the ink chamber on an ejection side of the substrate. A control circuitry layer is positioned on an ink ingress side of the substrate. An arcuate thermal actuator is fast with the control circuitry layer in a cantilever manner to be interposed between an ink reservoir and the ink chamber. The actuator is configured to straighten responsive to receipt of an electrical signal from the control circuitry layer so that ink within the ink chamber is ejected through the aperture.
1. A micro-electromechanical nozzle assembly comprising
a substrate that defines an ink chamber and an ink ejection port in fluid communication with the ink chamber on an ejection side of the substrate;
a control circuitry layer positioned on an ink ingress side of the substrate; and
an arcuate thermal actuator which is fast with the control circuitry layer in a cantilever manner to be interposed between an ink reservoir and the ink chamber, the actuator being configured to straighten responsive to receipt of an electrical signal from the control circuitry layer so that ink within the ink chamber is ejected through the aperture.
2. A micro-electromechanical nozzle assembly as claimed in claim 1 , wherein the ink chamber tapers inwardly towards the ink ejection port.
3. A micro-electromechanical nozzle assembly as claimed in claim 1 , wherein the thermal actuator includes a serpentine heating element which is electrically coupled to the control circuitry.
4. A micro-electromechanical nozzle assembly as claimed in claim 3 , wherein the actuator further comprises a pair of silicon layers, the heating element being interposed between the silicon layers.
5. A micro-electromechanical nozzle assembly as claimed in claim 4 , wherein one of the silicon layers comprises silicon dioxide material and the other silicon layer comprises silicon nitride.
6. A micro-electromechanical nozzle assembly as claimed in claim 3 , further comprising a pair of metal interconnects which each couple a respective end of the heating element to the control circuitry.
7. A micro-electromechanical nozzle assembly as claimed in claim 1 , wherein the heater element is of shape memory alloy (SMA) material and is fixed to one of the silicon layers, said one of the silicon layers being pre-stressed into an arcuate profile with the heater element being configured so that, when heated through its transition point, the heater element straightens the silicon layers such that the actuator is displaced towards the ink ejection port.