Organic light emitting display having a second frit portion configured to melt more easily than a frit portion
View Patent ↗An organic light emitting display includes a first substrate including a pixel region in which organic light emitting diodes are formed and a non-pixel region formed on the outer circumference of the pixel region. A second substrate is attached to the first substrate, and a sealing is provided between the first substrate and the second substrate. The sealing includes a first frit layer and a second frit layer which melts substantially more easily than the first frit layer upon irradiation of a laser or infrared beam thereto.
1. An organic light emitting display device, comprising:
a flat first substrate having a plate-like shape;
a flat second substrate having a plate-like shape and opposing the first substrate;
an array of organic light emitting pixels interposed between the first and second substrates; and
a stack of layers of glass frit portions, which forms a closed loop surrounding the array and interposed between the first and second substrates, wherein the stack of layers of glass frit portions comprises a first glass frit portion and a second glass frit portion, wherein the first glass frit portion is interposed between the first substrate and the second glass frit portion, and the second glass frit portion is interposed between the first glass frit portion and the second substrate, wherein the second glass frit portion comprises a material that melts substantially easier than the first glass frit portion upon irradiation of a laser or infrared beam thereto, and wherein the first glass frit portion and a surface of the first substrate contacting the first glass frit portion have different compositions,
wherein the first glass frit portion comprises a material and the second glass frit portion comprises the same material,
wherein each of the first and second glass frit portions comprises a light-to-heat conversion material configured to generate heat upon receiving the laser or infrared beam, and wherein the second glass frit portion comprises an amount of the light-to-heat conversion material substantially more than the first glass frit portion.
2. The device of claim 1 , wherein the second glass frit portion comprises a light-to-heat conversion material configured to generate heat upon receiving the laser or infrared beam, and wherein the first glass frit portion is substantially free of the light-to-heat conversion material.
3. The device of claim 1 , wherein the first glass frit portion is substantially transparent.
4. The device of claim 1 , wherein the second glass frit portion is substantially non-transparent.
5. The device of claim 1 , wherein one of the first and second glass frit portions comprises at least one selected from the group consisting of SiO 2 , PbO, V 2 O 5 , ZnO, B 2 O 3 , and P 2 O 5 .
6. The device of claim 1 , wherein the first glass frit portion comprises a first end facing the second substrate, the second glass frit portion comprises a second end facing the first substrate, wherein the first end has a first width perpendicular to the shortest imaginary line interconnecting the first and second substrates in a plane perpendicular to an elongation of the first segment, and wherein the second end has a second width in the same direction, wherein the first width is greater than the second width.
7. The device of claim 6 , wherein the second end contacts a peripheral portion of the first end along the direction.
8. The device of claim 6 , wherein the second end contacts a central portion of the first end along the direction.
9. The device of claim 1 , wherein the first glass frit portion comprises a first end facing the second substrate, the second glass frit portion comprises a second end facing the first substrate, wherein the first portion has a first height from the first substrate to the first end in a direction parallel to the shortest imaginary line interconnecting the first and second substrates in a plane perpendicular to an elongation of the first segment, wherein the second portion has a second height from the second substrate to the second end in the same direction, wherein the first height is greater than the second height.
10. The device of claim 1 , wherein the array is formed on the second substrate, and wherein the array and the first substrate form a gap therebetween.
11. The device of claim 1 , wherein the device is configured to display image through the first substrate.
12. The device of claim 1 , wherein the first glass frit portion has a volume substantially greater than that of the second glass fit portion.
13. The device of claim 1 , wherein the first glass frit portion is bonded to the first substrate by baking the first substrate and the first glass fit portion in contact with the first substrate.
14. The device of claim 1 , wherein the second glass frit portion is bonded to the second substrate and the first glass frit portion by applying a laser or infrared light thereto.
15. The device of claim 1 , further comprising at least one supplementary sealing structure extending along the first segment, wherein the at least one supplementary sealing structure is interposed between and interconnects the first and second substrates, wherein the supplementary sealing structure is located inside or outside the enclosed space.
16. The device of claim 15 , wherein the supplementary sealing structure is configured to improve sealing of the enclosed space.
17. The device of claim 1 , further comprising a first supplementary sealing structure and a second supplementary sealing structure, each of which is interposed between and interconnects the first and second substrates, wherein the first supplementary sealing structure extends along the first segment inside the enclosed space, and wherein the second supplementary sealing structure extends along the first segment outside the enclosed space.
18. The device of claim 1 , further comprising a supplementary sealing structure extending along the first segment and located inside or outside the enclosed space, wherein the supplementary sealing structure comprises a portion interposed between and interconnects the first glass frit portion and the second substrate.
19. The device of claim 18 , wherein the supplementary sealing structure comprises another portion that is not interposed between the first glass frit portion of the glass frit seal and the first substrates.
20. The device of claim 1 , further comprising a first supplementary sealing structure and a second supplementary sealing structure, each of which extends along the first segment inside or outside the enclosed space, wherein the first supplementary sealing structure is interposed between and interconnects the first and second substrates, wherein the second supplementary sealing structure is interposed between and interconnects the first glass frit portion and the second substrate.
21. The device of claim 1 , wherein the glass frit seal comprises one or more materials selected from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li 2 O), sodium oxide (Na 2 O), potassium oxide (K 2 O), boron oxide (B 2 O 3 ), vanadium oxide (V 2 O 5 ), zinc oxide (ZnO), tellurium oxide (TeO 2 ), aluminum oxide (Al 2 O 3 ), silicon dioxide (SiO 2 ), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P 2 O 5 ), ruthenium oxide (Ru 2 O), rubidium oxide (Rb 2 O), rhodium oxide (Rh 2 O), ferrite oxide (Fe 2 O 3 ), copper oxide (CuO), titanium oxide (TiO 2 ), tungsten oxide (WO 3 ), bismuth oxide (Bi 2 O 3 ), antimony oxide (Sb 2 O 3 ), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate.