IP Library Granted Patent US 7,595,260
Granted Patent B2
US 7,595,260 · App. 11/543,326 · Granted Sep 29, 2009

Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices

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Quick Facts
Patent No.
US 7,595,260
App. No.
11/543,326
Granted
Sep 29, 2009
Kind
B2
Abstract

A bulk-doped semiconductor may be at least one of the following: a single crystal, an elongated and bulk-doped semiconductor that at any point along its longitudinal axis, has a largest cross-sectional dimension less than 500 nanometers, and a free-standing and bulk-doped semiconductor with at least one portion having a smallest width of less than 500 nanometers. At least one portion of such a semiconductor may have a smallest width of less than 200 nanometers, or less than 150 nanometers, or less than 100 nanometers, or less than 80 nanometers, or less than 70 nanometers, or less than 60 nanometers, or less than 40 nanometers, or less than 20 nanometers, or less than 10 nanometers, or even less than 5 nanometers. Such a semiconductor may be doped during growth. Such a semiconductor may be part of a device, which may include any of a variety of devices and combinations thereof.

Claims (14)

1. A method of assembling a plurality of elongated structures on a surface of a substrate, wherein one or more of the elongated structures are at least one of the following: a single crystal, an elongated semiconductor that, at any point along its longitudinal axis, has a largest cross-sectional dimension less than 500 nanometers, and a free-standing semiconductor with at least one portion having a smallest width of less than 500 nanometers, and wherein the method comprises acts of:

(A) providing the one or more elongated structures;

(B) thereafter, dispersing the one or more elongated structures on a surface of a liquid phase to form a Langmuir-Blodgett film;

(C) compressing the Langmuir-Blodgett film; and

(D) transferring the compressed Langmuir-Blodgett film onto a surface of the substrate.

2. The method of claim 1 , wherein the one or more elongated structures comprises a nanowire.

3. The method of claim 1 , wherein the one or more elongated structures comprises a semiconductor nanowire.

4. The method of claim 3 , wherein the semiconductor nanowire is doped during growth of the nanowire.

5. The method of claim 3 , wherein the semiconductor nanowire is grown catalytically from a catalyst particle.

6. The method of claim 3 , wherein the semiconductor nanowire is grown using laser-assisted catalytic growth.

7. The method of claim 1 , wherein the one or more elongated structures comprises a bulk-doped semiconductor nanowire.

8. The method of claim 1 , wherein the one or more elongated structures has at least one portion having a smallest width of less than 500 nanometers.

9. The method of claim 1 , further comprising orienting the plurality of elongated structures using an electric field to align the plurality of elongated structures on the surface of the substrate.

10. The method of claim 1 , further comprising generating an electric field between at least two electrodes, and positioning the plurality of elongated structures between the electrodes.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jun 12, 2013
From: NANOSYS, INC.
To: NANOSYS, INC.
Reel/Frame 030599/0907 →
SECURITY AGREEMENT Recorded Apr 25, 2013
From: PRVP HOLDINGS, LLC
To: NANOSYS, INC.
Reel/Frame 030285/0829 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2007
From: LIEBER, CHARLES M.; CUI, YI; DUAN, XIANGFENG; HUANG, YU
To: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
Reel/Frame 020134/0118 →