Roll-to-roll fabricated electronically active device
An electronically active sheet, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; at least one semiconductor element having a first conductor and a second conductor. The electronically active sheet includes an adhesive having at least one semiconductor element fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination. The adhesive is activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor of the at least one semiconductor element is automatically brought into electrical communication with the electrically conductive pattern and so that the other of the first conductor and the second conductor of the at least one semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface of the first substrate.
1. An electronically active sheet, comprising:
a first substrate having an electrically conductive surface;
a second substrate having an electrically conductive pattern disposed thereon;
at least one semiconductor element, said at least one semiconductor element having a first conductor and a second conductor;
an adhesive having said at least one semiconductor element fixed thereto and disposed between said electrically conductive surface and said electrically conductive pattern to form a lamination, said adhesive being activatable to bind said second substrate to said first substrate so that one of said first conductor and said second conductor of said at least one semiconductor element is automatically brought into and maintained in electrical communication with said electrically conductive pattern of said second substrate and so that the other of said first conductor and said second conductor of said at least one semiconductor element is automatically brought into and maintained in electrical communication with said electrically conductive surface of said first substrate.
2. The electronically active sheet of claim 1 ;
wherein said first substrate, said second substrate and said adhesive are comprised of sheet material brought together from respective rolls in a continuous roll fabrication process.
3. The electronically active sheet of claim 1 ;
wherein said adhesive comprises a hotmelt material activatable by applying heat and pressure to said first and second substrates to soften said hotmelt material.
4. The electronically active sheet of claim 1 ;
wherein said adhesive is activatable by at least one of solvent action, evaporation, catalytic reaction and radiation curing.
5. The electronically active sheet of claim 1 ;
wherein said adhesive comprises a sheet; and
wherein before forming the lamination, said at least one semiconductor element is embedded into said sheet in a second pattern.
6. The electronically active sheet of claim 5 further comprising;
a transfer member; and
wherein said second pattern of said semiconductor elements is formed by electrostatically attracting a plurality of said semiconductor elements on said transfer member and transferring said pattern of said semiconductor elements onto said adhesive.
7. The electronically active sheet of claim 5 further comprising;
a transfer member; and
wherein said second pattern of said semiconductor elements is formed by magnetically attracting a plurality of said semiconductor elements on said transfer member and transferring said pattern of said semiconductor elements onto said adhesive.
8. The electronically active sheet of claim 5 ;
wherein said second pattern of said semiconductor elements is formable by a pick and place device.